RT4G150-LGG1657E

RT4G150-LGG1657E
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 1,288 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeExtendedOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-LGG1657E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150-LGG1657E is a flash-based RTG4™ FPGA from Microchip Technology, integrating fourth‑generation FPGA fabric with high-performance interfaces. It is designed for systems that require a high logic count, extensive I/O, and resistance to radiation‑induced configuration upsets in demanding environments.

This device targets applications in harsh environments—including space flight, high‑altitude aviation, medical electronics, and nuclear power plant control—by combining hardened logic elements, embedded DSP resources and SerDes communication capability for system-level integration and deterministic performance.

Key Features

  • Core FPGA Fabric — Fourth‑generation flash‑based RTG4 fabric with 151,824 logic elements and registers hardened by design against single‑event upsets (SEUs).
  • LUT and Performance — Each logic element includes a 4‑input LUT (LUT4) with fast carry chains; fabric and DSP timing are specified up to 300 MHz in the RTG4 family documentation.
  • Embedded Memory and DSP — Multiple embedded memory options and embedded multiply‑accumulate blocks suitable for DSP workloads; total on‑chip RAM reported as 5,325 bits.
  • High‑Speed Serial Interfaces — Native SerDes support with 3.125 Gbps performance and memory controller support for DDR2/DDR3/LPDDR as described in the RTG4 family material.
  • I/O Density — 720 user I/O pins for complex system integration and broad peripheral connectivity.
  • Power and Operating Range — Core supply range specified from 1.14 V to 1.26 V to match RTG4 operating conditions.
  • Extended Temperature Grade — Rated for operation from −55 °C to 125 °C, suitable for extended‑temperature applications.
  • Package and Mounting — 1657‑BCLGA package; supplier device package 1657‑CLGA with a 42.5 × 42.5 mm footprint; surface‑mount mount type.
  • Regulatory — RoHS compliant.

Typical Applications

  • Space and Aerospace Systems — Radiation‑tolerant design and hardened registers make the RT4G150 suitable for configuration stability in space flight and high‑altitude avionics.
  • High‑Reliability Industrial Control — Extended temperature range and high I/O count support control and monitoring systems in demanding industrial and nuclear environments.
  • Medical Electronics — Hardened FPGA fabric and deterministic DSP resources for medical instrumentation that requires robust operation in challenging conditions.
  • High‑Speed Communications — Integrated SerDes at 3.125 Gbps and DDR memory controller support enable high‑throughput link and buffering implementations.

Unique Advantages

  • Radiation‑Resistant Configuration — Registers and configuration elements are hardened by design against SEUs, reducing configuration upset risk in radiation environments.
  • High Logic Capacity — 151,824 logic elements allow implementation of large, complex digital systems on a single device.
  • Comprehensive I/O and Interfaces — 720 I/O pins plus native SerDes and DDR memory controller support simplify system partitioning and external connectivity.
  • Deterministic DSP Capability — Embedded multiply‑accumulate blocks and documented timing up to 300 MHz provide predictable performance for signal processing tasks.
  • Wide Operating Conditions — Extended grade operation from −55 °C to 125 °C and a defined core voltage window (1.14 V–1.26 V) make the device suitable for rugged applications.
  • Compact System Footprint — 1657‑BCLGA (1657‑CLGA 42.5 × 42.5 mm) package supports high integration in space‑constrained assemblies with surface‑mount mounting.

Why Choose RT4G150-LGG1657E?

The RT4G150-LGG1657E positions itself as a high‑capacity, radiation‑resilient FPGA option for developers building robust systems in demanding environments. With 151,824 logic elements, extensive I/O, embedded DSP resources, and hardened configuration registers, it supports large designs that require both compute density and configuration reliability.

Engineers designing avionics, spaceflight instruments, high‑reliability medical devices, or industrial control systems will find the RT4G150 attractive for its extended temperature rating, defined supply range, and high‑speed serial and memory interface support—backed by Microchip’s RTG4 family documentation and datasheet resources.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the RT4G150-LGG1657E.

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