RT4G150L-CBG1657PROTO

RT4G150L-CBG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 720 5200000 151824 1657-BCBGA

Quantity 1,984 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CBGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCBGANumber of I/O720Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5200000

Overview of RT4G150L-CBG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 720 5200000 151824 1657-BCBGA

The RT4G150L-CBG1657PROTO is a flash-based RTG4™ FPGA featuring a hardened FPGA fabric and high-performance interfaces on a single chip. It is designed for applications that require radiation resistance and deterministic signal processing in harsh environments.

Built with high logic density and integrated memory/DSP resources, this device targets space, high-altitude aviation, medical electronics and nuclear control applications where resistance to radiation-induced configuration upsets, reliable operation across a wide temperature range, and high-speed interfaces are essential.

Key Features

  • Core architecture — Flash-based FPGA fabric with 151,824 logic elements (registers) using 4-input LUTs and fast carry chains to support high-performance logic up to 300 MHz.
  • Radiation tolerance & reliability — Architecture and hardened registers provide resistance to radiation-induced single-event upsets (SEUs) and configuration upsets for use in challenging environments.
  • Embedded memory — Approximately 5.2 Mbits of on-chip RAM with multiple embedded memory options to support buffering and storage without external memory for many functions.
  • DSP and math blocks — Embedded multiply-accumulate blocks for digital signal processing tasks, with DSP operation performance up to 300 MHz.
  • High-speed interfaces — Native SerDes at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-bandwidth communication and external memory interfacing.
  • I/O and packaging — 720 user I/O in a 1657-CBGA (42.5 × 42.5 mm) surface-mount package; single 1.2 V core supply and military-grade operating temperature range of −55 °C to 125 °C.
  • System and development features — On-chip oscillator, clock conditioning circuits (CCC), JTAG and system controller SPI characteristics documented for system integration and debugging.

Typical Applications

  • Space systems — Radiation-resistant configuration and hardened registers make the RT4G150L-CBG1657PROTO suitable for satellite payloads and spacecraft electronics in LEO, MEO, GEO, HEO and deep-space missions.
  • High-altitude aviation and avionics — High-performance fabric, deterministic DSP and wide temperature range support avionics computing and sensor processing on high-altitude platforms.
  • Medical electronics — Integrated DSP and memory resources enable real-time signal processing and control functions in medical instrumentation operating under demanding environmental constraints.
  • Nuclear power control — Radiation-tolerant configuration and military-grade temperature specs support control and monitoring subsystems in nuclear environments.

Unique Advantages

  • Radiation-hardened architecture: Designed to resist radiation-induced configuration upsets and SEUs, reducing the need for external mitigation.
  • High logic density: 151,824 logic elements permit complex system integration on a single FPGA, reducing board-level complexity.
  • Integrated memory and DSP: Approximately 5.2 Mbits of embedded memory plus MAC blocks enable high-throughput signal processing without excessive external memory.
  • High-speed external connectivity: Native 3.125 Gbps SerDes and DDR memory controller support streamline high-bandwidth data paths.
  • Wide thermal and grade range: Military-grade qualification and −55 °C to 125 °C operating range for deployment in extreme environments.
  • Compact manufacturable package: 1657-CBGA (42.5 × 42.5 mm) surface-mount package with 720 I/O supports dense system designs and standard PCB assembly flows.

Why Choose RT4G150L-CBG1657PROTO?

The RT4G150L-CBG1657PROTO combines radiation-tolerant, flash-based FPGA fabric with high logic density, integrated memory and DSP capabilities, and high-speed serial interfaces—making it well suited for mission-critical designs in aerospace, defense, medical and nuclear applications. Its military-grade thermal range and hardened registers deliver reliability where environmental and radiation stressors are primary design concerns.

Backed by comprehensive datasheet documentation and manufacturer support resources, this device offers a well-documented platform for engineers developing long-lifecycle, high-reliability systems that require deterministic performance and on-chip integration.

Request a quote or submit an inquiry for RT4G150L-CBG1657PROTO to evaluate suitability for your next high-reliability design.

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