RT4G150L-CBG1657PROTO
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 720 5200000 151824 1657-BCBGA |
|---|---|
| Quantity | 1,984 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CBGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCBGA | Number of I/O | 720 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5200000 |
Overview of RT4G150L-CBG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 720 5200000 151824 1657-BCBGA
The RT4G150L-CBG1657PROTO is a flash-based RTG4™ FPGA featuring a hardened FPGA fabric and high-performance interfaces on a single chip. It is designed for applications that require radiation resistance and deterministic signal processing in harsh environments.
Built with high logic density and integrated memory/DSP resources, this device targets space, high-altitude aviation, medical electronics and nuclear control applications where resistance to radiation-induced configuration upsets, reliable operation across a wide temperature range, and high-speed interfaces are essential.
Key Features
- Core architecture — Flash-based FPGA fabric with 151,824 logic elements (registers) using 4-input LUTs and fast carry chains to support high-performance logic up to 300 MHz.
- Radiation tolerance & reliability — Architecture and hardened registers provide resistance to radiation-induced single-event upsets (SEUs) and configuration upsets for use in challenging environments.
- Embedded memory — Approximately 5.2 Mbits of on-chip RAM with multiple embedded memory options to support buffering and storage without external memory for many functions.
- DSP and math blocks — Embedded multiply-accumulate blocks for digital signal processing tasks, with DSP operation performance up to 300 MHz.
- High-speed interfaces — Native SerDes at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-bandwidth communication and external memory interfacing.
- I/O and packaging — 720 user I/O in a 1657-CBGA (42.5 × 42.5 mm) surface-mount package; single 1.2 V core supply and military-grade operating temperature range of −55 °C to 125 °C.
- System and development features — On-chip oscillator, clock conditioning circuits (CCC), JTAG and system controller SPI characteristics documented for system integration and debugging.
Typical Applications
- Space systems — Radiation-resistant configuration and hardened registers make the RT4G150L-CBG1657PROTO suitable for satellite payloads and spacecraft electronics in LEO, MEO, GEO, HEO and deep-space missions.
- High-altitude aviation and avionics — High-performance fabric, deterministic DSP and wide temperature range support avionics computing and sensor processing on high-altitude platforms.
- Medical electronics — Integrated DSP and memory resources enable real-time signal processing and control functions in medical instrumentation operating under demanding environmental constraints.
- Nuclear power control — Radiation-tolerant configuration and military-grade temperature specs support control and monitoring subsystems in nuclear environments.
Unique Advantages
- Radiation-hardened architecture: Designed to resist radiation-induced configuration upsets and SEUs, reducing the need for external mitigation.
- High logic density: 151,824 logic elements permit complex system integration on a single FPGA, reducing board-level complexity.
- Integrated memory and DSP: Approximately 5.2 Mbits of embedded memory plus MAC blocks enable high-throughput signal processing without excessive external memory.
- High-speed external connectivity: Native 3.125 Gbps SerDes and DDR memory controller support streamline high-bandwidth data paths.
- Wide thermal and grade range: Military-grade qualification and −55 °C to 125 °C operating range for deployment in extreme environments.
- Compact manufacturable package: 1657-CBGA (42.5 × 42.5 mm) surface-mount package with 720 I/O supports dense system designs and standard PCB assembly flows.
Why Choose RT4G150L-CBG1657PROTO?
The RT4G150L-CBG1657PROTO combines radiation-tolerant, flash-based FPGA fabric with high logic density, integrated memory and DSP capabilities, and high-speed serial interfaces—making it well suited for mission-critical designs in aerospace, defense, medical and nuclear applications. Its military-grade thermal range and hardened registers deliver reliability where environmental and radiation stressors are primary design concerns.
Backed by comprehensive datasheet documentation and manufacturer support resources, this device offers a well-documented platform for engineers developing long-lifecycle, high-reliability systems that require deterministic performance and on-chip integration.
Request a quote or submit an inquiry for RT4G150L-CBG1657PROTO to evaluate suitability for your next high-reliability design.

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