RT4G150L-CGG1657E
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 663 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Extended | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-CGG1657E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150L-CGG1657E is a flash-based RTG4 FPGA device from Microchip Technology, combining fourth-generation FPGA fabric with high-performance interfaces on a single chip. It targets applications that require radiation-hardened-by-design logic and robust I/O integration for use in challenging environments.
Key architectural elements include 151,824 logic elements (registers) with 4-input LUTs and fast carry chains, embedded memory and DSP resources, native SerDes, and memory controller support—making the device suitable for space, high-altitude aviation, medical electronics, and nuclear control systems where resistance to radiation-induced configuration upsets is required.
Key Features
- Flash-based FPGA Fabric Flash-configured RTG4 fabric with logic hardened by design against radiation-induced single-event upsets (SEUs).
- Logic Capacity 151,824 logic elements (registers) implemented with 4-input Look-Up Tables (LUT4) and fast carry chains; fabric performance up to 300 MHz.
- Embedded Memory & DSP Multiple embedded memory options with a total of approximately 5,325 bits of on-chip RAM and dedicated multiply-accumulate blocks for DSP functions up to 300 MHz.
- High-Speed Serial and Memory Interfaces Native SerDes capable of 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-throughput external memory interfacing.
- Rich I/O Up to 720 user I/O pins to support dense system integration and multiple peripheral interfaces.
- Power and Thermal Recommended supply voltage range: 1.14 V to 1.26 V; operating temperature range: −55 °C to 125 °C.
- Package and Mounting Supplied in a 1657-BFCCGA package (supplier device package: 1657-CCGA, 42.5 × 42.5 mm) for surface-mount applications.
- Extended Grade & Compliance Extended-grade device with RoHS compliance for regulated manufacturing environments.
Typical Applications
- Space Systems Radiation-hardened-by-design logic and SerDes enable use in low-Earth to deep-space flight electronics where SEU resistance is required.
- High-Altitude and Avionics Extended temperature range and hardened configuration are suited to high-altitude avionics and aerospace subsystems.
- Medical Electronics Deterministic logic and embedded DSP resources support precision signal processing and control in medical instrumentation.
- Nuclear Power Plant Control Robust configuration and extended operating conditions make the device applicable to control systems in nuclear facilities.
Unique Advantages
- Radiation-hardened-by-design Logical elements and configuration architecture are hardened against SEUs to maintain configuration integrity in harsh radiation environments.
- High fabric performance LUT4-based logic with fast carry chains and fabric timing up to 300 MHz supports demanding processing and control tasks.
- Integrated high-speed interfaces Built-in 3.125 Gbps SerDes and DDR2/DDR3/LPDDR memory controller support reduce external interface complexity.
- Large I/O count Up to 720 user I/O pins allow dense system connectivity without excessive board-level multiplexing.
- Extended operating range Rated for −55 °C to 125 °C operation and supplied in a rugged 1657-CCGA package for surface-mount deployment.
- Comprehensive documentation Supported by datasheet, technical briefs, pin descriptions and related Microchip documentation to assist development and qualification.
Why Choose RT4G150L-CGG1657E?
The RT4G150L-CGG1657E positions itself as a rugged, high-capacity FPGA for applications that demand radiation resilience, deterministic logic performance, and extensive I/O. With 151,824 logic elements, embedded memory and DSP resources, native high-speed SerDes, and memory controller support, the device is well suited to engineers developing systems for space, avionics, medical, and nuclear control where configuration integrity and long-term robustness matter.
Backed by Microchip’s RTG4 family documentation and engineered for extended operating conditions, this device supports designs that require scalable logic, high-throughput interfaces, and deployment in challenging environments.
Request a quote or submit an availability inquiry to discuss pricing, lead times, and sample options for RT4G150L-CGG1657E.

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