| N/A | | XMC7100D-F144K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,060 | |
 | | XMC7100D-F144K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 144QFP | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,470 | |
 | | XMC7100D-F176K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 984 | |
 | | XMC7200-E272K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 693 | |
 | | XMC7200-F176K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 157 | |
 | | XMC7200D-E272K8384AA | Infineon Technologies | IC MCU 32BIT 8.188MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 423 | |
 | | XMC7200D-F176K8384AA | Infineon Technologies | IC MCU 32BT 8.188MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 219 | |
 | | XMC7201SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 1,106 | |
 | | XMC7241SCQ040XAAXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 514 | |
 | | XMC8231SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 875 | |
| N/A | N/A | XMS430FR2311IPW16 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 853 | |
| N/A | N/A | XMS430FR2433IYQWR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 585 | |
| N/A | N/A | XMS430FR2522IPW16 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 961 | |
| N/A | N/A | XMS430FR2633IYQWR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 262 | |
| N/A | | XMS430G2955IDA38R | Texas Instruments | IC MCU 16BIT 56KB FLASH 38TSSOP | Microcontrollers | 38-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 56KB (56K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 38-TSSOP | 498 | |
 | N/A | XMS432P401RIRGCT | Texas Instruments | IC MCU 32BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 14x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 430 | |
 | N/A | XMS432P401RIZXHR | Texas Instruments | IC MCU 32BIT 256KB FLASH 80NFBGA | Microcontrollers | 80-NFBGA (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 18x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-NFBGA (5×5) | 591 | |
 | | XMSP430F5438IPZ | Texas Instruments | IC MCU 16BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 487 | |
 | N/A | XMSP432P401RIPZR | Texas Instruments | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 26x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,505 | |
 | | XOMAP3503BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 1,794 | |