Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XOMAP3515BCBBXOMAP3515BCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
622
XOMAP3525BCBBXOMAP3525BCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
597
XOMAP3530BCBBXOMAP3530BCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
344
N/AXOMAPL137AZKB3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 256BGAMicroprocessors256-BGAN/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
776
XOMAPL137BZKB3XOMAPL137BZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
120
XOMAPL137DZKBA3XOMAPL137DZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
500
XOMAPL138ZCEXOMAPL138ZCETexas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (13×13)
Additional Interfaces:
HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
56
XOMAPL138ZWTXOMAPL138ZWTTexas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Additional Interfaces:
HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
628
XPC823CZT66B2TXPC823CZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
433
N/AN/AXPC823ECZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
638
XPC823EVR66B2XPC823EVR66B2NXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
1,892
XPC823EVR75B2XPC823EVR75B2NXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
252
N/AN/AXPC823EZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
1,158
N/AN/AXPC823EZT75BANXP SemiconductorsIC MPU 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
476
XPC823ZT66B2TXPC823ZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
199
XPC823ZT75B2TXPC823ZT75B2TNXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
88
XPC823ZT81B2TXPC823ZT81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
368
XPC8240LVV200EXPC8240LVV200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI, UART
613
XPC8240LZU200EXPC8240LZU200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)3.3V0°C – 105°C
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
954
XPC8240RVV250EXPC8240RVV250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI, UART
1,222

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