| N/A | N/A | XMS430FR2433IYQWR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 982 | |
| N/A | N/A | XMS430FR2522IPW16 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,623 | |
| N/A | N/A | XMS430FR2633IYQWR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 535 | |
| N/A | | XMS430G2955IDA38R | Texas Instruments | IC MCU 16BIT 56KB FLASH 38TSSOP | Microcontrollers | 38-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 56KB (56K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 38-TSSOP | 705 | |
 | N/A | XMS432P401RIRGCT | Texas Instruments | IC MCU 32BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 14x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 845 | |
 | N/A | XMS432P401RIZXHR | Texas Instruments | IC MCU 32BIT 256KB FLASH 80NFBGA | Microcontrollers | 80-NFBGA (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 18x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-NFBGA (5×5) | 717 | |
 | | XMSP430F5438IPZ | Texas Instruments | IC MCU 16BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 742 | |
 | N/A | XMSP432P401RIPZR | Texas Instruments | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 26x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 845 | |
 | | XOMAP3503BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) | 361 | |
 | | XOMAP3515BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) | 806 | |
 | | XOMAP3525BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) | 825 | |
 | | XOMAP3530BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) | 931 | |
| N/A | | XOMAPL137AZKB3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 256BGA | Microprocessors | 256-BGA | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA | 1,621 | |
 | | XOMAPL137BZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 1,398 | |
 | | XOMAPL137DZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 613 | |
 | | XOMAPL138ZCE | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (13×13) | 775 | |
 | | XOMAPL138ZWT | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (16×16) | 1,130 | |
 | | XPC823CZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 675 | |
| N/A | N/A | XPC823ECZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 13 | |
 | | XPC823EVR66B2 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 435 | |