Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,705
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XPC850DECVR50BUXPC850DECVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
750
XPC850DECZT50BUXPC850DECZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
502
XPC850DEZT50BTXPC850DEZT50BTNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
261
XPC850DEZT50BUXPC850DEZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
872
XPC850DSLCZT50BUXPC850DSLCZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
478
XPC850DSLZT50BUXPC850DSLZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
246
XPC850SRZT50BUXPC850SRZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
941
XPC850ZT50BUXPC850ZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
1,202
XRM41L232PZTXRM41L232PZTTexas InstrumentsIC MCU 16/32B 128KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,161
XRM42L432PZTXRM42L432PZTTexas InstrumentsIC MCU 16/32B 384KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
87
XRM44L520APZTXRM44L520APZTTexas InstrumentsIC MCU 32BIT 768KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
120MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,205
XRM46L852PGETXRM46L852PGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,419
XRM48L950PGETXRM48L950PGETTexas InstrumentsIC MCU 16/32BIT 3MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
545
XRM48L950ZWTTXRM48L950ZWTTTexas InstrumentsIC MCU 16/32B 3MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,246
XRM48L952PGETXRM48L952PGETTexas InstrumentsIC MCU 16/32BIT 3MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
655
XRM48L952ZWTTXRM48L952ZWTTTexas InstrumentsIC MCU 16/32B 3MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
263
XRM57L843ZWTTXRM57L843ZWTTTexas InstrumentsIC MCU 32BIT 4MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
330MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
145
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 57×10/12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,452
XS3A1T3157GMXXS3A1T3157GMXNexperia USA Inc.IC SWITCH SPDT X 1 900MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT886 (1.45x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
40ns, 20ns
-3db Bandwidth:
40MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
35pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT886 (1.45×1)
268
XS3A1T3157GSHXS3A1T3157GSHNexperia USA Inc.IC SWITCH SPDT X 1 900MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT1202 (1x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
40ns, 20ns
-3db Bandwidth:
40MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
35pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT1202 (1×1)
680
XS3A1T5157GMXXS3A1T5157GMXNexperia USA Inc.IC SWITCH SPDT X 1 900MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT886 (1.45x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
900mOhm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
40ns, 20ns
-3db Bandwidth:
40MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
35pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT886 (1.45×1)
936

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