Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ASFC32G31T3-51BINN/AASFC32G31T3-51BINAlliance Memory, Inc.IC FLASH 256GBIT EMMC 153FBGAeMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
175
ASFC32G31T3-51BINTRN/AASFC32G31T3-51BINTRAlliance Memory, Inc.IC FLASH 256GBIT EMMC 153FBGAeMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
895
ASFC4G31M-51BINN/AASFC4G31M-51BINAlliance Memory, Inc.IC FLASH 32GBIT MMC 153FBGAFlash Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,857
ASFC4G31M-51BINTRN/AASFC4G31M-51BINTRAlliance Memory, Inc.IC FLASH 32GBIT EMMC 153FBGAeMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
N/A
624
ASFC4G31MA-51BINN/AASFC4G31MA-51BINAlliance Memory, Inc.4GB, EMMC 5.1, 3V, INDUSTRIAL GReMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND (MLC)
Write Cycle Time Word Page:
N/A
413
ASFC4G31MA-51BINTRN/AASFC4G31MA-51BINTRAlliance Memory, Inc.4GB, EMMC 5.1, 3V, INDUSTRIAL GReMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND (MLC)
Write Cycle Time Word Page:
N/A
1,311
ASFC64G31T5-51BINN/AASFC64G31T5-51BINAlliance Memory, Inc.IC FLASH 512GBIT EMMC 153FBGAeMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
64G x 8
Memory Size:
512 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
392
ASFC64G31T5-51BINTRN/AASFC64G31T5-51BINTRAlliance Memory, Inc.IC FLASH 512GBIT EMMC 153FBGAeMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
64G x 8
Memory Size:
512 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
788
ASFC8G31M-51BINN/AASFC8G31M-51BINAlliance Memory, Inc.IC FLASH 64GBIT MMC 153FBGAFlash Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
8G x 8
Memory Size:
64 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
447
ASFC8G31M-51BINTRN/AASFC8G31M-51BINTRAlliance Memory, Inc.IC FLASH 64GBIT MMC 153FBGAFlash Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
8G x 8
Memory Size:
64 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
N/A
202
ASFC8G31MA-51BINASFC8G31MA-51BINAlliance Memory, Inc.8GB, EMMC 5.1, 3V, INDUSTRIAL GReMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
8G x 8
Memory Size:
64 bit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND (MLC)
Write Cycle Time Word Page:
N/A
127
ASFC8G31MA-51BINTRASFC8G31MA-51BINTRAlliance Memory, Inc.8GB, EMMC 5.1, 3V, INDUSTRIAL GReMMC Memory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
8G x 8
Memory Size:
64 bit
Memory Type:
Non-Volatile
Packaging:
153-WFBGA
Qualification:
N/A
Technology:
FLASH - NAND (MLC)
Write Cycle Time Word Page:
N/A
682
ASP00886IRGCTASP00886IRGCTTexas InstrumentsIC MCU 16BIT 32KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
614
AT32AP7000-CTURAT32AP7000-CTURMicrochip TechnologyIC MCU 32BIT ROMLESS 256CTBGAMicrocontrollers256-CTBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-CTBGA (17×17)
Package / Case:
256-LBGA
1,059
AT32AP7000-CTUTAT32AP7000-CTUTMicrochip TechnologyIC MCU 32BIT ROMLESS 256CTBGAMicrocontrollers256-CTBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-CTBGA (17×17)
Package / Case:
256-LBGA
385
AT32AP7001-ALUTAT32AP7001-ALUTMicrochip TechnologyIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, POR, PWM, WDT
Number of I/O:
90
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,492
AT32AP7002-CTURAT32AP7002-CTURMicrochip TechnologyIC MCU 32BIT ROMLESS 196CTBGAMicrocontrollers196-CTBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
85
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-CTBGA (12×12)
Package / Case:
196-TFBGA, CSBGA
1,688
AT32AP7002-CTUTAT32AP7002-CTUTMicrochip TechnologyIC MCU 32BIT ROMLESS 196CTBGAMicrocontrollers196-CTBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
85
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-CTBGA (12×12)
Package / Case:
196-TFBGA, CSBGA
1,603
AT32AP7200-CFURAT32AP7200-CFURMicrochip TechnologyIC MCU 32BIT ROMLESS 324TFBGAMicrocontrollers324-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
146
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-TFBGA (15×15)
Package / Case:
324-TFBGA
446
AT32AP7200-CFUTAT32AP7200-CFUTMicrochip TechnologyIC MCU 32BIT ROMLESS 324TFBGAMicrocontrollers324-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
AVR
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
146
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 3.6V
Data Converters:
D/A 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-TFBGA (15×15)
Package / Case:
324-TFBGA
222

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