 | N/A | ASFC32G31T3-51BIN | Alliance Memory, Inc. | IC FLASH 256GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 32G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 175 | |
 | N/A | ASFC32G31T3-51BINTR | Alliance Memory, Inc. | IC FLASH 256GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 32G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 895 | |
 | N/A | ASFC4G31M-51BIN | Alliance Memory, Inc. | IC FLASH 32GBIT MMC 153FBGA | Flash Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 4G x 8 Write Cycle Time Word Page: N/A | 1,857 | |
 | N/A | ASFC4G31M-51BINTR | Alliance Memory, Inc. | IC FLASH 32GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 4G x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: N/A | 624 | |
 | N/A | ASFC4G31MA-51BIN | Alliance Memory, Inc. | 4GB, EMMC 5.1, 3V, INDUSTRIAL GR | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 413 | |
 | N/A | ASFC4G31MA-51BINTR | Alliance Memory, Inc. | 4GB, EMMC 5.1, 3V, INDUSTRIAL GR | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 1,311 | |
 | N/A | ASFC64G31T5-51BIN | Alliance Memory, Inc. | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 392 | |
 | N/A | ASFC64G31T5-51BINTR | Alliance Memory, Inc. | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 788 | |
 | N/A | ASFC8G31M-51BIN | Alliance Memory, Inc. | IC FLASH 64GBIT MMC 153FBGA | Flash Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8G x 8 Write Cycle Time Word Page: N/A | 447 | |
 | N/A | ASFC8G31M-51BINTR | Alliance Memory, Inc. | IC FLASH 64GBIT MMC 153FBGA | Flash Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8G x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: N/A | 202 | |
 | | ASFC8G31MA-51BIN | Alliance Memory, Inc. | 8GB, EMMC 5.1, 3V, INDUSTRIAL GR | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 127 | |
 | | ASFC8G31MA-51BINTR | Alliance Memory, Inc. | 8GB, EMMC 5.1, 3V, INDUSTRIAL GR | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 682 | |
 | | ASP00886IRGCT | Texas Instruments | IC MCU 16BIT 32KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 614 | |
 | | AT32AP7000-CTUR | Microchip Technology | IC MCU 32BIT ROMLESS 256CTBGA | Microcontrollers | 256-CTBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-CTBGA (17×17) | 1,059 | |
 | | AT32AP7000-CTUT | Microchip Technology | IC MCU 32BIT ROMLESS 256CTBGA | Microcontrollers | 256-CTBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-CTBGA (17×17) | 385 | |
 | | AT32AP7001-ALUT | Microchip Technology | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,492 | |
 | | AT32AP7002-CTUR | Microchip Technology | IC MCU 32BIT ROMLESS 196CTBGA | Microcontrollers | 196-CTBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-CTBGA (12×12) Package / Case: 196-TFBGA, CSBGA | 1,688 | |
 | | AT32AP7002-CTUT | Microchip Technology | IC MCU 32BIT ROMLESS 196CTBGA | Microcontrollers | 196-CTBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-CTBGA (12×12) Package / Case: 196-TFBGA, CSBGA | 1,603 | |
 | | AT32AP7200-CFUR | Microchip Technology | IC MCU 32BIT ROMLESS 324TFBGA | Microcontrollers | 324-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-TFBGA (15×15) | 446 | |
 | | AT32AP7200-CFUT | Microchip Technology | IC MCU 32BIT ROMLESS 324TFBGA | Microcontrollers | 324-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-TFBGA (15×15) | 222 | |