Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AT6010A-4ACAT6010A-4ACMicrochip TechnologyIC FPGA 120 I/O 144LQFPFPGAs144-LQFP (20x20)4.75 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
120
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
6400
Qualification:
N/A
1,158
AT6010A-4AIAT6010A-4AIMicrochip TechnologyIC FPGA 120 I/O 144LQFPFPGAs144-LQFP (20x20)4.5 V - 5.5 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
30000
Number of I/O:
120
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
6400
Qualification:
N/A
1,409
AT6010ALV-4ACAT6010ALV-4ACMicrochip TechnologyIC FPGA 120 I/O 144LQFPFPGAs144-LQFP (20x20)3.135 V - 3.465 V0°C – 70°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
120
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
6400
Qualification:
N/A
1,025
AT6010H-2QCAT6010H-2QCMicrochip TechnologyIC FPGA 204 I/O 240QFPFPGAs240-PQFP (32x32)4.75 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
204
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
6400
Qualification:
N/A
1,356
AT6010HLV-4QCAT6010HLV-4QCMicrochip TechnologyIC FPGA 204 I/O 240QFPFPGAs240-PQFP (32x32)3.135 V - 3.465 V0°C – 70°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
204
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
6400
Qualification:
N/A
118
AT75C220-C256AT75C220-C256Microchip TechnologyIC MPU SIAP 40MHZ 256BGAMicroprocessors256-BGA (15x15)N/A–
Core Processor:
ARM7TDMI
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Co-Processors/DSP:
Signal Processing; OakDSP
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
Voltage – I/O:
3.3V
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-BGA (15×15)
562
AT75C220-Q208AT75C220-Q208Microchip TechnologyIC MPU SIAP 40MHZ 208QFPMicroprocessors208-PQFP (28x28)N/A–
Core Processor:
ARM7TDMI
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Co-Processors/DSP:
Signal Processing; OakDSP
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
Voltage – I/O:
3.3V
Mounting Type:
Surface Mount
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
812
AT75C310-Q160AT75C310-Q160Microchip TechnologyIC MPU SIAP 40MHZ 160QFPMicroprocessors160-PQFP (28x28)N/A–
Core Processor:
ARM7TDMI
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Co-Processors/DSP:
Signal Processing; OakDSP
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Mounting Type:
Surface Mount
Package / Case:
160-BQFP
Supplier Device Package:
160-PQFP (28×28)
955
AT80251G2D-3CSUMAT80251G2D-3CSUMMicrochip TechnologyIC MCU 8/16BIT ROMLESS 40PDILMicrocontrollers40-PDILN/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIL
Package / Case:
40-DIP (0.600″”, 15.24mm)
226
AT80251G2D-RLTUMAT80251G2D-RLTUMMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44VQFPMicrocontrollers44-VQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-VQFP (10×10)
Package / Case:
44-LQFP
430
AT80251G2D-SLRUMAT80251G2D-SLRUMMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
228
AT80251G2D-SLSULAT80251G2D-SLSULMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
816
AT80251G2D-SLSUMAT80251G2D-SLSUMMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
1,081
N/AAT80571PH0772MLIntelIC MPU 2.93GHZ 775LGAMicroprocessors775-LGA (37.5x37.5)N/A74.1°C (TC)
Core Processor:
Intel® Pentium® Processor E6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
2.93GHz
Voltage – I/O:
0.85V, 1.363V
Operating Temperature:
74.1°C (TC)
Mounting Type:
Surface Mount
Package / Case:
775-LGA
Supplier Device Package:
775-LGA (37.5×37.5)
Grade:
Commercial
824
N/AN/AAT80601000897ABIntelIC MPU 2.8GHZ 1366FCLGAMicroprocessors1366-FCLGA (42.5x45)N/A67.9°C (TC)
Core Processor:
Intel® Xeon® Processor W3530
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
2.8GHz
RAM Controllers:
DDR3
Voltage – I/O:
0.8V, 1.375V
Operating Temperature:
67.9°C (TC)
Mounting Type:
Surface Mount
Package / Case:
1366-LGA
Supplier Device Package:
1366-FCLGA (42.5×45)
Grade:
Commercial
923
AT80C31X2-3CSULAT80C31X2-3CSULMicrochip TechnologyIC MCU 8BIT ROMLESS 40PDILMicrocontrollers40-PDILN/A-40°C ~ 85°C (TA)
Core Processor:
80C51
Core Size:
8-Bit
Speed:
30/20MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIL
Package / Case:
40-DIP (0.600″”, 15.24mm)
326
AT80C31X2-3CSUMAT80C31X2-3CSUMMicrochip TechnologyIC MCU 8BIT ROMLESS 40PDILMicrocontrollers40-PDILN/A-40°C ~ 85°C (TA)
Core Processor:
80C51
Core Size:
8-Bit
Speed:
40/20MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIL
Package / Case:
40-DIP (0.600″”, 15.24mm)
748
AT80C31X2-RLTULAT80C31X2-RLTULMicrochip TechnologyIC MCU 8BIT ROMLESS 44VQFPMicrocontrollers44-VQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
80C51
Core Size:
8-Bit
Speed:
30/20MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-VQFP (10×10)
Package / Case:
44-LQFP
344
AT80C31X2-RLTUMAT80C31X2-RLTUMMicrochip TechnologyIC MCU 8BIT ROMLESS 44VQFPMicrocontrollers44-VQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
80C51
Core Size:
8-Bit
Speed:
40/20MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-VQFP (10×10)
Package / Case:
44-LQFP
12
AT80C31X2-SLRULAT80C31X2-SLRULMicrochip TechnologyIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
80C51
Core Size:
8-Bit
Speed:
30/20MHz
Connectivity:
UART/USART
Peripherals:
POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
793

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