 | | AT6010A-4AC | Microchip Technology | IC FPGA 120 I/O 144LQFP | FPGAs | 144-LQFP (20x20) | 4.75 V - 5.25 V | 0°C – 70°C | Number of Logic Elements/Cells: 6400 | 1,158 | |
 | | AT6010A-4AI | Microchip Technology | IC FPGA 120 I/O 144LQFP | FPGAs | 144-LQFP (20x20) | 4.5 V - 5.5 V | -40°C – 85°C | Number of Logic Elements/Cells: 6400 | 1,409 | |
 | | AT6010ALV-4AC | Microchip Technology | IC FPGA 120 I/O 144LQFP | FPGAs | 144-LQFP (20x20) | 3.135 V - 3.465 V | 0°C – 70°C | Number of Logic Elements/Cells: 6400 | 1,025 | |
 | | AT6010H-2QC | Microchip Technology | IC FPGA 204 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 4.75 V - 5.25 V | 0°C – 70°C | Number of Logic Elements/Cells: 6400 | 1,356 | |
 | | AT6010HLV-4QC | Microchip Technology | IC FPGA 204 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 3.135 V - 3.465 V | 0°C – 70°C | Number of Logic Elements/Cells: 6400 | 118 | |
 | | AT75C220-C256 | Microchip Technology | IC MPU SIAP 40MHZ 256BGA | Microprocessors | 256-BGA (15x15) | N/A | – | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; OakDSP Mounting Type: Surface Mount Supplier Device Package: 256-BGA (15×15) | 562 | |
 | | AT75C220-Q208 | Microchip Technology | IC MPU SIAP 40MHZ 208QFP | Microprocessors | 208-PQFP (28x28) | N/A | – | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; OakDSP Mounting Type: Surface Mount Supplier Device Package: 208-PQFP (28×28) | 812 | |
 | | AT75C310-Q160 | Microchip Technology | IC MPU SIAP 40MHZ 160QFP | Microprocessors | 160-PQFP (28x28) | N/A | – | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; OakDSP Mounting Type: Surface Mount Supplier Device Package: 160-PQFP (28×28) | 955 | |
 | | AT80251G2D-3CSUM | Microchip Technology | IC MCU 8/16BIT ROMLESS 40PDIL | Microcontrollers | 40-PDIL | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIL Package / Case: 40-DIP (0.600″”, 15.24mm) | 226 | |
 | | AT80251G2D-RLTUM | Microchip Technology | IC MCU 8/16BIT ROMLESS 44VQFP | Microcontrollers | 44-VQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-VQFP (10×10) | 430 | |
 | | AT80251G2D-SLRUM | Microchip Technology | IC MCU 8/16BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.6x16.6) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.6×16.6) Package / Case: 44-LCC (J-Lead) | 228 | |
 | | AT80251G2D-SLSUL | Microchip Technology | IC MCU 8/16BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.6x16.6) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.6×16.6) Package / Case: 44-LCC (J-Lead) | 816 | |
 | | AT80251G2D-SLSUM | Microchip Technology | IC MCU 8/16BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.6x16.6) | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.6×16.6) Package / Case: 44-LCC (J-Lead) | 1,081 | |
| N/A | | AT80571PH0772ML | Intel | IC MPU 2.93GHZ 775LGA | Microprocessors | 775-LGA (37.5x37.5) | N/A | 74.1°C (TC) | Core Processor: Intel® Pentium® Processor E6500 Number of Cores/Bus Width: 2 Core, 64-Bit Voltage – I/O: 0.85V, 1.363V Operating Temperature: 74.1°C (TC) Mounting Type: Surface Mount Supplier Device Package: 775-LGA (37.5×37.5) | 824 | |
| N/A | N/A | AT80601000897AB | Intel | IC MPU 2.8GHZ 1366FCLGA | Microprocessors | 1366-FCLGA (42.5x45) | N/A | 67.9°C (TC) | Core Processor: Intel® Xeon® Processor W3530 Number of Cores/Bus Width: 4 Core, 64-Bit Voltage – I/O: 0.8V, 1.375V Operating Temperature: 67.9°C (TC) Mounting Type: Surface Mount Supplier Device Package: 1366-FCLGA (42.5×45) | 923 | |
 | | AT80C31X2-3CSUL | Microchip Technology | IC MCU 8BIT ROMLESS 40PDIL | Microcontrollers | 40-PDIL | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIL Package / Case: 40-DIP (0.600″”, 15.24mm) | 326 | |
 | | AT80C31X2-3CSUM | Microchip Technology | IC MCU 8BIT ROMLESS 40PDIL | Microcontrollers | 40-PDIL | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIL Package / Case: 40-DIP (0.600″”, 15.24mm) | 748 | |
 | | AT80C31X2-RLTUL | Microchip Technology | IC MCU 8BIT ROMLESS 44VQFP | Microcontrollers | 44-VQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-VQFP (10×10) | 344 | |
 | | AT80C31X2-RLTUM | Microchip Technology | IC MCU 8BIT ROMLESS 44VQFP | Microcontrollers | 44-VQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-VQFP (10×10) | 12 | |
 | | AT80C31X2-SLRUL | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Microcontrollers | 44-PLCC (16.6x16.6) | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.6×16.6) Package / Case: 44-LCC (J-Lead) | 793 | |