DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,054
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM13S128324A-6BIG2MESMT128Mb DDR SDRAM Ind.DRAM Memory144-FBGA2.375V ~ 2.625V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
144-FBGA
506
N/AM13S2561616A-4BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
467
N/AM13S2561616A-4BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
745
N/AM13S2561616A-4TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,651
N/AM13S2561616A-4TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,110
N/AM13S2561616A-5BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
894
N/AM13S2561616A-5BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
1,210
N/AM13S2561616A-5TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
15
N/AM13S2561616A-5TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
625
N/AM13S2561616A-6BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
355
N/AM13S2561616A-6BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
866
N/AM13S2561616A-6TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
784
N/AM13S2561616A-6TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
887
N/AM13S5121632A-5TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,868
N/AM13S5121632A-5TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
888
N/AM13S5121632A-6TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
461
N/AM13S5121632A-6TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
399
N/AM13S64164A-4TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
502
N/AM13S64164A-5TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
88
N/AM13S64164A-6TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,266

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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