DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM13S2561616A-4TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
616
N/AM13S2561616A-4TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
696
N/AM13S2561616A-5BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
71
N/AM13S2561616A-5BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
673
N/AM13S2561616A-5TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
653
N/AM13S2561616A-5TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
800
N/AM13S2561616A-6BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
288
N/AM13S2561616A-6BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
777
N/AM13S2561616A-6TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
22
N/AM13S2561616A-6TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
889
N/AM13S5121632A-5TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
411
N/AM13S5121632A-5TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,665
N/AM13S5121632A-6TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
540
N/AM13S5121632A-6TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
18
N/AM13S64164A-4TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
22
N/AM13S64164A-5TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,318
N/AM13S64164A-6TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,223
N/AM14D128168A-1.5BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
667 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
741
N/AM14D128168A-1.6BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
600 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
1,002
N/AM14D128168A-1.8BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
800

Featured Brands

About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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