DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,054
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM12L64322A-5BG2SESMT64Mb SDRAMDRAM Memory90-BGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
561
N/AM12L64322A-5TG2SESMT64Mb SDRAMDRAM Memory86-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
86-TSOP II
17
N/AM12L64322A-6BG2SESMT64Mb SDRAMDRAM Memory90-BGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
1,095
N/AM12L64322A-6TG2SESMT64Mb SDRAMDRAM Memory86-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
86-TSOP II
1,586
N/AM12L64322A-7BG2SESMT64Mb SDRAMDRAM Memory90-BGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
1,644
N/AM12L64322A-7TG2SESMT64Mb SDRAMDRAM Memory86-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
86-TSOP II
63
N/AM13D64322A-4.5BG2SESMT64Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
222 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
702
N/AM13D64322A-4BG2SESMT64Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
1,490
N/AM13D64322A-5BG2SESMT64Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
1,632
N/AM13S128168A-4.5BG2SESMT128Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
225 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
12.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
21
N/AM13S128168A-4.5TG2SESMT128Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
225 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
12.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,783
N/AM13S128168A-4BG2SESMT128Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
749
N/AM13S128168A-4TG2SESMT128Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,491
N/AM13S128168A-5BG2SESMT128Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
60
N/AM13S128168A-5TG2SESMT128Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
131
N/AM13S128168A-6BG2SESMT128Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
1,544
N/AM13S128168A-6TG2SESMT128Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,166
N/AM13S128324A-3.6BIG2MESMT128Mb DDR SDRAM Ind.DRAM Memory144-FBGA2.5V ~ 2.7V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
275 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
144-FBGA
366
N/AM13S128324A-4BIG2MESMT128Mb DDR SDRAM Ind.DRAM Memory144-FBGA2.375V ~ 2.625V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
144-FBGA
445
N/AM13S128324A-5BIG2MESMT128Mb DDR SDRAM Ind.DRAM Memory144-FBGA2.375V ~ 2.625V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
144-FBGA
932

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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