DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM12L5121632A-6B(2T)ESMT512Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
1,217
N/AM12L5121632A-6BG2TESMT512Mb SDRAMDRAM MemoryBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-BGA
1,879
N/AM12L5121632A-6T(2T)ESMT512Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
626
N/AM12L5121632A-6TG2TESMT512Mb SDRAMDRAM MemoryTSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
26
N/AM12L5121632A-7B(2T)ESMT512Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
915
N/AM12L5121632A-7BG2TESMT512Mb SDRAMDRAM MemoryBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-BGA
1,016
N/AM12L5121632A-7T(2T)ESMT512Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
544
N/AM12L5121632A-7TG2TESMT512Mb SDRAMDRAM MemoryTSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
1,726
N/AM12L64164A-5B(2C)ESMT64Mb SDRAM Ind.DRAM Memory54 TSOPII/ 54 VBGA2.5V-40°C – 85°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 TSOPII/ 54 VBGA
265
N/AM12L64164A-5BG2CESMT64Mb SDRAMDRAM Memory54-VBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-VBGA
1,086
N/AM12L64164A-5T(2C)ESMT64Mb SDRAM Ind.DRAM Memory54 TSOPII/ 54 VBGA2.5V-40°C – 85°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 TSOPII/ 54 VBGA
773
N/AM12L64164A-5TG2CESMT64Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
1,043
N/AM12L64164A-7B(2C)ESMT64Mb SDRAM Ind.DRAM Memory54 TSOPII/ 54 VBGA2.5V-40°C – 85°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 TSOPII/ 54 VBGA
474
N/AM12L64164A-7BG2CESMT64Mb SDRAMDRAM Memory54-VBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-VBGA
959
N/AM12L64164A-7T(2C)ESMT64Mb SDRAM Ind.DRAM Memory54 TSOPII/ 54 VBGA2.5V-40°C – 85°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 TSOPII/ 54 VBGA
627
N/AM12L64164A-7TG2CESMT64Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
378
N/AM12L64322A (2S)ESMT64Mb SDRAM Ind.DRAM Memory86 TSOPII/ 90 BGA2.5V-40°C – 85°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
2M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
86 TSOPII/ 90 BGA
1,171
N/AM12L64322A-5BG2SESMT64Mb SDRAMDRAM Memory90-BGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
346
N/AM12L64322A-5TG2SESMT64Mb SDRAMDRAM Memory86-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
86-TSOP II
1,017
N/AM12L64322A-6BG2SESMT64Mb SDRAMDRAM Memory90-BGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
820

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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