DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AKGD-64Mbx16/-128Mbx8-DDR-II-SDRAM-1.8VESMTDDR2 SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR SDRAM
Memory Organization:
64M x 16 / 128M x 8
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
377
N/AN/AKGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5VESMTDDR3 SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR3 SDRAM
Memory Organization:
64M x 16 / 128M x 8
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
1,544
N/AN/AKGD-64Mbx32-LPDDR2-SDRAM-1.2V/1.8VESMTLPDDR2 SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
561
N/AN/AKGD-64Mbx32-LPDDR3-SDRAM-1.2VESMTLPDDR3 SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR3 SDRAM
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
902
N/AN/AKGD-8Mbx16-DDR-II-SDRAM-1.8VESMTDDR2 SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
27
N/AN/AKGD-8Mbx16-DDR-SDRAM-1.8V/2.5VESMTDDR SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
646
N/AN/AKGD-8Mbx16-SDRAM-1.8V/2.5V/3.3VESMTSDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
287
N/AN/AKGD-8Mbx32-LPDDR-SDRAM-1.8VESMTLPDDR SDRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR SDRAM
Memory Organization:
8M x 32
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
538
N/AN/AKGD-8Mbx8-PSRAM,-1.8VESMTPSRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
PSRAM
Memory Organization:
8M x 8
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
1,130
N/AN/AKGD-8Mbx8-PSRAM,-2.7~3.6VESMTPSRAM KGDDRAM MemoryN/A2.5VN/A
Memory Size:
N/A
Clock Frequency:
N/A
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
PSRAM
Memory Organization:
8M x 8
Memory Interface:
Parallel
Grade:
Known Good Die
Qualification:
N/A
Packaging:
N/A
585
N/AM12L128168A (2S)ESMT128Mb SDRAM Ind.DRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V-40°C – 85°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
373
N/AM12L128168A-5BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
1,074
N/AM12L128168A-5TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
1,437
N/AM12L128168A-6BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
504
N/AM12L128168A-6TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
188
N/AM12L128168A-7BG2SESMT128Mb SDRAMDRAM Memory54-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
352
N/AM12L128168A-7TG2SESMT128Mb SDRAMDRAM Memory54-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
616
N/AM12L128324A-5BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
952
N/AM12L128324A-6BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
1,964
N/AM12L128324A-7BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
279

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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