DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,054
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM12L128324A-5BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
925
N/AM12L128324A-6BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
215
N/AM12L128324A-7BG2CESMT128Mb SDRAMDRAM Memory90-FBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
128 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
834
N/AM12L16161A-5T(2R)ESMT16Mb SDRAM Ind.DRAM Memory50PIN TSOP2.5V-40°C – 85°C
Memory Size:
16 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
50PIN TSOP
631
N/AM12L16161A-5TG2RESMT16Mb SDRAMDRAM Memory50-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
16 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
50-TSOP II
1,206
N/AM12L16161A-7T(2R)ESMT16Mb SDRAM Ind.DRAM Memory50PIN TSOP2.5V-40°C – 85°C
Memory Size:
16 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
50PIN TSOP
666
N/AM12L16161A-7TG2RESMT16Mb SDRAMDRAM Memory50-TSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
16 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
512K x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
50-TSOP II
519
N/AM12L2561616A-5B(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
54
N/AM12L2561616A-5BG2TESMT256Mb SDRAMDRAM MemoryBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-BGA
779
N/AM12L2561616A-5T(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
1,431
N/AM12L2561616A-5TG2TESMT256Mb SDRAMDRAM MemoryTSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
217
N/AM12L2561616A-6B(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
128
N/AM12L2561616A-6BG2TESMT256Mb SDRAMDRAM MemoryBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-BGA
266
N/AM12L2561616A-6T(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
370
N/AM12L2561616A-6TG2TESMT256Mb SDRAMDRAM MemoryTSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
1,463
N/AM12L2561616A-7B(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
785
N/AM12L2561616A-7BG2TESMT256Mb SDRAMDRAM MemoryBGA3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-BGA
854
N/AM12L2561616A-7T(2T)ESMT256Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
16M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
727
N/AM12L2561616A-7TG2TESMT256Mb SDRAMDRAM MemoryTSOPII3.0V ~ 3.6V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-TSOP II
793
N/AM12L5121632A-5B(2T)ESMT512Mb SDRAMDRAM Memory54 pin TSOPII/ 54 Ball FBGA2.5V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 pin TSOPII/ 54 Ball FBGA
471

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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