DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AM16U4G16256A (2Z)ESMT4Gb DDR4 SDRAM Auto.DRAM Memory96 Ball BGA2.5V-40°C – 105°C
Memory Size:
4 Gbit
Clock Frequency:
1.6 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
14.25 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
JEDEC
Packaging:
96 Ball BGA
958
N/AM16U4G16256A-2400ESMT4Gb DDR4 SDRAM Ind.DRAM Memory96 Ball BGA2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
1.2 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
14.16 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
96 Ball BGA
180
N/AM16U4G16256A-2666ESMT4Gb DDR4 SDRAM Ind.DRAM Memory96 Ball BGA2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
1.333 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
96 Ball BGA
366
N/AM16U4G16256A-2666(2Z)ESMT4Gb DDR4 SDRAM Auto.DRAM Memory96 Ball BGA2.5V-40°C – 105°C
Memory Size:
4 Gbit
Clock Frequency:
1.333 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
JEDEC
Packaging:
96 Ball BGA
1,360
N/AM16U4G16256A-3200ESMT4Gb DDR4 SDRAM Ind.DRAM Memory96 Ball BGA2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
1.6 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
96 Ball BGA
99
N/AM16U4G16256A-3200(2Z)ESMT4Gb DDR4 SDRAM Auto.DRAM Memory96 Ball BGA2.5V-40°C – 105°C
Memory Size:
4 Gbit
Clock Frequency:
1.6 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
JEDEC
Packaging:
96 Ball BGA
684
N/AM16U4G8512A-2666(2Z)ESMT4Gb DDR4 SDRAM Ind.DRAM Memory78 Ball BGA2.5V-40°C – 95°C
Memory Size:
4 Gbit
Clock Frequency:
1.333 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
512M x 8
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
78 Ball BGA
146
N/AM16U4G8512A-3200(2Z)ESMT4Gb DDR4 SDRAM Ind.DRAM Memory78 Ball BGA2.5V-40°C – 95°C
Memory Size:
4 Gbit
Clock Frequency:
1.6 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
13.75 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR4 SDRAM
Memory Organization:
512M x 8
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
78 Ball BGA
771
N/AN/AM24D6488CA (2A)ESMTOctal PSRAMDRAM Memory24 ball BGA2.5VN/A
Memory Size:
N/A
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
PSRAM
Memory Organization:
8M x 8
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
24 ball BGA
978
N/AN/AM24D6488PA (2A)ESMTPSRAM Ind.DRAM Memory24 ball BGA2.5V-40°C – 85°C
Memory Size:
N/A
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
PSRAM
Memory Organization:
8M x 8
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
24 ball BGA
944
N/AN/AM24L6488CA (2A)ESMTOctal PSRAM Ind.DRAM Memory24 ball BGA2.5V-40°C – 85°C
Memory Size:
N/A
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
PSRAM
Memory Organization:
8M x 8
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
24 ball BGA
1,221
N/AM52D2561616A-5BG2FESMT256Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
1,131
N/AM52D2561616A-5BIG2FESMT256Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
539
N/AM52D2561616A-6BG2FESMT256Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
537
N/AM52D2561616A-6BIG2FESMT256Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
97
N/AM52D2561616A-7BG2FESMT256Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
8
N/AM52D2561616A-7BIG2FESMT256Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
627
N/AM52D256328A-6BG2FESMT256Mb SDRAMDRAM Memory90-FBGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5.4 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 32
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
543
N/AM52D256328A-7BG2FESMT256Mb SDRAMDRAM Memory90-FBGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 32
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-FBGA
1,053
N/AM52D5121632A-5BGESMT512Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
1,934

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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