DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM52D5121632A-5BIGESMT512Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
1,681
N/AM52D5121632A-6BGESMT512Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
1,325
N/AM52D5121632A-6BIGESMT512Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
1,846
N/AM52D5121632A-7BGESMT512Mb SDRAMDRAM Memory54-FBGA (8x8)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54-FBGA
1,222
N/AM52D5121632A-7BIGESMT512Mb SDRAM Ind.DRAM Memory54-FBGA (8x8)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
54-FBGA
1,365
N/AM52D5123216A-5BGESMT512Mb SDRAMDRAM Memory90-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
10 ns
Access Time:
4.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
1,248
N/AM52D5123216A-6BGESMT512Mb SDRAMDRAM Memory90-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
1,608
N/AM52D5123216A-6BIGESMT512Mb SDRAM Ind.DRAM Memory90-BGA (8x13)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
12 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
90-BGA
625
N/AM52D5123216A-7BGESMT512Mb SDRAMDRAM Memory90-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
LVCMOS
Grade:
Commercial
Qualification:
JEDEC
Packaging:
90-BGA
851
N/AM52D5123216A-7BIGESMT512Mb SDRAM Ind.DRAM Memory90-BGA (8x13)1.7V ~ 1.95V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
143 MHz
Write Cycle Time Word Page:
14 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
LVCMOS
Grade:
Industrial
Qualification:
JEDEC
Packaging:
90-BGA
196
N/AN/AM52D64322A (2S)ESMT64Mb SDRAMDRAM Memory54 Ball FBGA2.5V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPSDR SDRAM
Memory Organization:
2M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
54 Ball FBGA
216
N/AM53D2561616A-5BG2FESMT256Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
545
N/AM53D2561616A-6BG2FESMT256Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
535
N/AM53D2561616A-7.5BG2FESMT256Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
133 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
682
N/AM53D256328A-5BG2FESMT256Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
197
N/AM53D256328A-6BG2FESMT256Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
887
N/AM53D256328A-7.5BG2FESMT256Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
133 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
2M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
17
N/AM53D5121632A-5BGESMT512Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
603
N/AM53D5121632A-6BGESMT512Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
1,484
N/AM53D5121632A-7.5BGESMT512Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
133 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
631

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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