DRAM Memory

Suntsu’s DRAM memory catalog offers high-performance volatile memory solutions for data-intensive computing, industrial automation, networking, and embedded systems. Whether you need high-speed DDR4, LPDDR, or legacy SDRAM chips, our extensive inventory helps engineers and purchasing managers secure reliable components with minimal lead times. Use our advanced part search tool to filter by density, speed, configuration, or manufacturer to find the exact DRAM solution that will keep your production line running smoothly.

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Total Products: 3,051
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM53D5123216A-5BGESMT512Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
599
N/AM53D5123216A-6BGESMT512Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
1,025
N/AM53D5123216A-7.5BGESMT512Mb LPDDR SDRAMDRAM Memory144-FBGA (12x12)1.7V ~ 1.95V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
133 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
6 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
144-UFBGA, FCBGA
1,518
N/AM53D64164A-4.5BG2CESMT64Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
220 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
322
N/AM53D64164A-5BG2CESMT64Mb LPDDR SDRAMDRAM Memory60-BGA (8x13)1.7V ~ 1.95V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-UFBGA
441
N/AM54D1G1664AESMT1Gb LPDDR2 SDRAMDRAM Memory134 BGA2.5V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 BGA
291
N/AM54D1G1664A (2G)ESMT1Gb LPDDR2 SDRAMDRAM Memory134 BGA2.5V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 BGA
856
N/AM54D1G3232AESMT1Gb LPDDR2 SDRAMDRAM Memory134 BGA2.5V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
32M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 BGA
749
N/AM54D1G3232A (2G)ESMT1Gb LPDDR2 SDRAMDRAM Memory134 BGA2.5V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
32M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 BGA
1,157
N/AM54D2G16128AESMT2Gb LPDDR2 SDRAMDRAM Memory134 Ball BGA2.5V-25°C – 85°C
Memory Size:
2 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
128M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 Ball BGA
800
N/AM54D2G3264AESMT2Gb LPDDR2 SDRAMDRAM Memory134 Ball BGA2.5V-25°C – 85°C
Memory Size:
2 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 Ball BGA
413
N/AN/AM54D2G3264A (2C)ESMT2Gb LPDDR2 SDRAM Ind.DRAM Memory134 Ball BGA2.5V-40°C – 85°C
Memory Size:
2 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
134 Ball BGA
800
N/AN/AM54D4G32128ZA(2C)ESMT4Gb LPDDR2 SDRAM Ind.DRAM Memory134 Ball BGA2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
128M x 32
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
134 Ball BGA
419
N/AM54D5121632AESMT512Mb LPDDR2 SDRAMDRAM Memory134 Ball BGA2.5V-25°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 Ball BGA
349
N/AM54D5123216AESMT512Mb LPDDR2 SDRAMDRAM Memory134 Ball BGA2.5V-25°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR2 SDRAM
Memory Organization:
16M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
134 Ball BGA
467
N/AM55D1G1664A-CDBG2YESMT1Gb LPDDR3 SDRAMDRAM Memory178-BGA (10x11.5)1.14V ~ 1.30V, 1.70V ~ 1.95V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
800 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
178-BGA
715
N/AM55D1G1664A-CDBIG2YESMT1Gb LPDDR3 SDRAM Ind.DRAM Memory178-BGA (10x11.5)1.14V ~ 1.30V, 1.70V ~ 1.95V-40°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
800 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
178-BGA
1,601
N/AM55D1G1664A-EEBG2YESMT1Gb LPDDR3 SDRAMDRAM Memory178-BGA (10x11.5)1.14V ~ 1.30V, 1.70V ~ 1.95V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
933 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
178-BGA
48
N/AM55D1G1664A-EEBIG2YESMT1Gb LPDDR3 SDRAM Ind.DRAM Memory178-BGA (10x11.5)1.14V ~ 1.30V, 1.70V ~ 1.95V-40°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
933 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
178-BGA
1,873
N/AM55D1G1664A-GFBG2YESMT1Gb LPDDR3 SDRAMDRAM Memory178-BGA (10x11.5)1.14V ~ 1.30V, 1.70V ~ 1.95V-25°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
1.066 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
5.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
178-BGA
893

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About DRAM Memory

Dynamic Random-Access Memory (DRAM) is a type of high-density, volatile semiconductor memory designed for quick data access and low-latency processing. It requires a continuous power supply and a dynamic refresh cycle to maintain stored information. DRAM serves as the primary working memory in digital systems, enabling microprocessors and microcontrollers to efficiently read and write active data. The DRAM category encompasses various generations and form factors, including standard DDR SDRAM, low-power LPDDR for energy-sensitive mobile devices, and legacy DDR2 or DDR3 variants that are customized for long-lifecycle industrial applications.

Engineers evaluate key performance metrics when specifying DRAM chips, including clock speed, data rate, bus width, and operating temperature range, in order to maximize system throughput. These memory integrated circuits (ICs) are essential components in enterprise computing, telecommunications infrastructure, automotive infotainment, and industrial automation. Suntsu offers a comprehensive selection of reliable DRAM solutions that seamlessly integrate with advanced processors, field-programmable gate arrays (FPGAs), and other complementary memory components, ensuring optimal performance in demanding digital designs.

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