Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8541PXAPF
MPC8541PXAPFNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,249
MPC8541VTAJD
MPC8541VTAJDNXP SemiconductorsIC MPU MPC85XX 533MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
129
MPC8541VTALF
MPC8541VTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,550
MPC8541VTAPF
MPC8541VTAPFNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
822
MPC8543ECVJAQGD
MPC8543ECVJAQGDNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
1,088
MPC8543VJANGD
MPC8543VJANGDNXP SemiconductorsIC MPU MPC85XX 800MHZ 783BGAMicroprocessors783-PBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, Cryptography, Kasumi, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA
Supplier Device Package:
783-PBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
191
MPC8543VTANGD
MPC8543VTANGDNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
1,632
N/A
MPC8544CVJALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
863
MPC8544CVJANGA
MPC8544CVJANGANXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,908
MPC8544CVJAQGA
MPC8544CVJAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
311
MPC8544CVTALF
MPC8544CVTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
526
MPC8544CVTALFA
MPC8544CVTALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,775
MPC8544CVTANG
MPC8544CVTANGNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
962
MPC8544CVTAQGA
MPC8544CVTAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,463
MPC8544ECVJAQGA
MPC8544ECVJAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,627
MPC8544ECVTALFA
MPC8544ECVTALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
1,236
MPC8544ECVTAQG
MPC8544ECVTAQGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
911
MPC8544ECVTAQGA
MPC8544ECVTAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,437
MPC8544EVJANGA
MPC8544EVJANGANXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
957
MPC8544EVJAQGA
MPC8544EVJAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,993

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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