Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8544EVJARJA
MPC8544EVJARJANXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
880
MPC8544EVTANGA
MPC8544EVTANGANXP SemiconductorsPOWERQUICC RISC MICROPROCESSORS,MicroprocessorsN/AN/AN/A

N/A

698
MPC8544EVTAQG
MPC8544EVTAQGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
692
MPC8544EVTAQGA
MPC8544EVTAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
1,382
MPC8544EVTARJA
MPC8544EVTARJANXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,981
MPC8544VJALFA
MPC8544VJALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
781
MPC8544VJANGA
MPC8544VJANGANXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
98
MPC8544VJAQGA
MPC8544VJAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
504
MPC8544VJARJA
MPC8544VJARJANXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI
412
MPC8544VTANGA
MPC8544VTANGANXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
1,894
MPC8544VTAQG
MPC8544VTAQGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCBGAMicroprocessors783-FCBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
924
MPC8544VTAQGA
MPC8544VTAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
137
MPC8545EVJANGD
MPC8545EVJANGDNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
45
MPC8545VJAQGD
MPC8545VJAQGDNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
1,790
N/A
MPC8545VJATGDNXP SemiconductorsIC MPU MPC85XX 1.2GHZ 783BGAMicroprocessors783-PBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, Cryptography, Kasumi, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA
Supplier Device Package:
783-PBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
343
MPC8547ECVJAQGD
MPC8547ECVJAQGDNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
760
MPC8547EHXAUJ
MPC8547EHXAUJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 783FCBGAMicroprocessors783-FCBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
278
MPC8547EVJAQGD
MPC8547EVJAQGDNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
1,177
MPC8547EVJATGD
MPC8547EVJATGDNXP SemiconductorsIC MPU MPC85XX 1.2GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
491
MPC8547EVTATGD
MPC8547EVTATGDNXP SemiconductorsIC MPU MPC85XX 1.2GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, RapidIO
27

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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