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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8275ZQMIBAMPC8275ZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
629
MPC8280CVVQLDAMPC8280CVVQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
852
MPC8280CVVUPEAMPC8280CVVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
883
MPC8280CZUQLDAMPC8280CZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
310
MPC8280CZUUPEAMPC8280CZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
452
MPC8280VVQLDAMPC8280VVQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,311
MPC8280VVUPEAMPC8280VVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
212
MPC8280ZUQLDAMPC8280ZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
828
MPC8280ZUUPEAMPC8280ZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,775
MPC8306CVMABDCAMPC8306CVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
576
MPC8306CVMACDCAMPC8306CVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
487
MPC8306CVMADDCAMPC8306CVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
181
MPC8306CVMAFDCAMPC8306CVMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
CAN, DUART, I2C, MMC/SD, SPI, TDM
260
MPC8306SCVMABDCAMPC8306SCVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
862
MPC8306SCVMACDCAMPC8306SCVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
832
MPC8306SCVMADDCAMPC8306SCVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
21
MPC8306SCVMAFDCAMPC8306SCVMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
DUART, I2C, SPI, TDM
1,702
MPC8306SVMABDCAMPC8306SVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
475
MPC8306SVMACDCAMPC8306SVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
DUART, I2C, SPI, TDM
993
MPC8306SVMADDCAMPC8306SVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
299

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