MPC8280VVQLDA

The MPC8280VVQLDA is a PowerPC G2_LE based 32-bit microprocessor provided by NXP Semiconductors. This single‑core MPU is specified at 333 MHz and integrates a range of communication controllers and memory interfaces, targeted for embedded applications that require on‑chip communications and system control.

Designed for embedded system designs, the device combines a PowerQUICC II family architecture with multiple Ethernet ports, USB 2.0, serial controllers and DRAM/SDRAM support to deliver a compact, network‑oriented processing solution in a 480‑TBGA package.

Key Features

• Core – PowerPC G2_LE single core, 32‑bit processor running at 333 MHz with dual‑issue integer core architecture and separate caches for instructions and data.
• Memory – Integrated DRAM and SDRAM controllers for system memory support; on‑chip instruction and data caches (16 KB I‑cache and 16 KB D‑cache as documented for the family).
• Communications Co‑processors – Includes communications and RISC CPM co‑processors to handle dedicated communications tasks.
• Ethernet – Three 10/100 Mbps Ethernet interfaces to support multi‑port networking functions.
• USB – USB 2.0 full/low‑rate support (one port) for peripheral connectivity.
• Serial and Peripheral Interfaces – Multiple serial communications controllers (SCCs) and additional interfaces including I2C for peripheral control and connectivity.
• System Integration – Includes multi‑channel/factory communication controllers and a PCI bridge as part of the PowerQUICC II family feature set.
• Package and Mounting – 480‑TBGA (37.5 × 37.5 mm) lead‑free ball grid array with exposed pad, surface‑mount package.
• Electrical and Environmental – 3.3 V I/O specification and RoHS‑compliant lead‑free package; operating temperature range 0 °C to 105 °C.
• Qualification – Consumer qualification level.

Typical Applications

• Embedded Communications Systems – On‑chip Ethernet and serial controllers make this MPU suitable for networked embedded controllers and communications appliances.
• Networking Equipment – Multiple 10/100 Mbps Ethernet ports and a PCI bridge support multi‑port network interface and bridging applications.
• Peripheral‑Connected Embedded Devices – USB 2.0 and I2C interfaces enable integration with human‑machine interfaces, storage, and peripheral modules.
• Industrial and Consumer Embedded Controllers – DRAM/SDRAM support and communications co‑processors facilitate complex control and protocol tasks in embedded products.

Unique Advantages

• Balanced processing and communications: A PowerPC G2_LE core paired with communications co‑processors and multiple MACs enables separation of control and protocol handling within a single device.
• Integrated networking interfaces: Three 10/100 Mbps Ethernet ports and USB 2.0 reduce the need for external controllers when implementing multi‑port network functions.
• Memory subsystem support: On‑chip DRAM/SDRAM controllers and dedicated caches reduce external memory complexity and help streamline system memory design.
• Compact, production‑ready package: The 480‑TBGA (37.5 × 37.5 mm) lead‑free package with exposed pad supports surface‑mount assembly in space‑constrained embedded designs.
• Industry‑grade operating range: Specified operation from 0 °C to 105 °C accommodates typical consumer and many industrial ambient conditions.
• RoHS compliance: Lead‑free, RoHS‑compliant construction supports environmentally conscious manufacturing requirements.

Why Choose MPC8280VVQLDA?

The MPC8280VVQLDA positions itself as an integrated embedded processing solution combining a PowerPC G2_LE core with a strong set of on‑chip communications and memory interfaces. Its mix of Ethernet ports, USB, serial controllers, and DRAM/SDRAM support makes it suitable for designers building networked embedded systems and communications‑centric products.

Backed by NXP Semiconductors and documented as part of the PowerQUICC II family, this device offers a coherent feature set for engineers who need a compact, RoHS‑compliant MPU that consolidates processing and communications functions into a single surface‑mount package.

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