MPC8280ZUUPEA

IC MPU MPC82XX 450MHZ 480TBGA
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 450MHz 480-TBGA (37.5x37.5)

Quantity 541 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8280
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed450MHzSupplier Device Package480-TBGA (37.5×37.5)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8280ZUUPEA – IC MPU PowerPC G2_LE 450MHz 480-TBGA

The MPC8280ZUUPEA is a single-core, 32-bit PowerPC G2_LE microprocessor running at 450 MHz in a 480-TBGA (37.5×37.5 mm) package. Designed for embedded communications and control applications, it integrates a high-performance core with multiple on-chip peripherals to support networking and system-level functions.

With on-chip DRAM/SDRAM controllers, multiple 10/100 Mbps Ethernet interfaces and USB 2.0 connectivity, the MPC8280ZUUPEA targets designs that require consolidated I/O, predictable processing capability, and a surface-mount package for compact system integration. It is RoHS-compliant and specified for operation from 0 °C to 105 °C.

Key Features

  • Core Dual-issue integer PowerPC G2_LE core operating at 450 MHz; single 32-bit core suitable for embedded control and communications tasks.
  • Caches Separate 16 KB instruction and 16 KB data caches; four-way set associative, physically addressed with LRU replacement (as described in product hardware specifications).
  • On-chip Co-processors Includes communications and RISC CPM co-processor capabilities to support protocol and peripheral offload functions.
  • Memory Controllers Integrated DRAM and SDRAM controllers to support system memory without extensive external logic.
  • Ethernet & USB Three 10/100 Mbps Ethernet interfaces and one USB 2.0 port provide multiple host connectivity options for networking and peripheral access.
  • Additional Interfaces I²C support and multiple serial communication controllers available per family documentation for peripheral and control plane integration.
  • Power & IO 3.3 V I/O voltage for compatibility with a wide range of legacy and contemporary logic levels.
  • Package & Mounting 480-TBGA supplier device package (37.5×37.5 mm) with a 480-LBGA exposed pad package case; surface-mount mounting for board-level assembly.
  • Environmental RoHS-compliant with operating temperature range specified from 0 °C to 105 °C.

Typical Applications

  • Embedded Networking Appliances Leverage three 10/100 Mbps Ethernet interfaces and USB 2.0 connectivity for routers, gateways, and small network appliances.
  • Communications Equipment Integrated communications co-processors and serial interfaces enable protocol handling and peripheral offload in telecom and data communications modules.
  • System Controllers Single-core PowerPC performance with on-chip DRAM/SDRAM controllers suits control and management functions in embedded platforms.
  • Industrial and Commercial Electronics Operation up to 105 °C and 3.3 V I/O make the device appropriate for thermally demanding consumer and commercial embedded systems.

Unique Advantages

  • Integrated Communications Peripherals: Multiple Ethernet ports, USB 2.0 and serial controllers reduce external component count and simplify board design.
  • Balanced On-chip Memory Architecture: 16 KB instruction and 16 KB data caches with four-way associativity provide predictable on-chip performance for embedded code execution.
  • Compact High-pin-count Package: 480-TBGA (37.5×37.5 mm) package delivers high I/O density in a surface-mount form factor for space-constrained designs.
  • Wide Operating Range: Specified operation from 0 °C to 105 °C supports deployment in systems with elevated thermal requirements.
  • Standards-aligned I/O Voltage: 3.3 V I/O support ensures compatibility with common peripheral and interface standards.
  • Regulatory Readiness: RoHS compliance supports use in products requiring lead-free components.

Why Choose MPC8280ZUUPEA?

The MPC8280ZUUPEA combines a PowerPC G2_LE single core running at 450 MHz with a suite of on-chip communications peripherals and memory controllers to provide a compact, integrated solution for embedded networking and control designs. Its cache architecture and integrated co-processors support efficient handling of protocol and system tasks while minimizing external components.

This part is suited to engineers and procurement teams building consumer and commercial embedded systems that require consolidated I/O, robust thermal capability to 105 °C, and a high-pin-count BGA footprint for board-level integration. The RoHS-compliant construction and standard 3.3 V I/O simplify compliance and interoperability across system designs.

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