MPC8306SVMADDCA

The MPC8306SVMADDCA is a PowerPC-based microprocessor built on the e300c3 core, delivering a single 32-bit core running at 266 MHz. It is positioned as a cost-effective, highly integrated communications processor for networking and embedded applications.

Designed for compact, networked systems, the device targets residential gateways, modem/routers, industrial control and test & measurement applications by combining CPU performance, integrated peripheral engines, and streamlined board-level integration to address time-to-market, power, and space constraints.

Key Features

• Core & Performance PowerPC e300c3 core with a single 32‑bit CPU at 266 MHz; includes 16 KB L1 instruction and 16 KB L1 data caches, dual integer units and on‑chip MMU for responsive embedded processing.
• Memory & DMA Integrated 16‑bit DDR2 memory controller and two DMA engines to support efficient memory transfers and system throughput.
• Communications Engine Built‑in Communications/QUICC Engine to accelerate protocol handling and offload networking tasks from the main core.
• Ethernet & USB Three 10/100 Mbps Ethernet interfaces and one USB 2.0 port provide multiport connectivity for networked designs.
• On‑chip Peripherals Rich peripheral set described in the product family documentation, including HDLC, TDM/SI, DUART, I2C, timers, GPIO and SPI (see datasheet for full listings).
• Package & Mounting 369‑ball PBGA (19 × 19 mm) surface‑mount package; supplied in tray packaging for production use.
• Operating Range Specified operating temperature range of 0 °C to 105 °C and Consumer qualification.
• System Design Resources Part of the PowerQUICC II Pro family with published hardware specifications and electrical characteristics for system integration and thermal guidance.

Typical Applications

• Residential Gateways — Use the integrated Ethernet ports, USB 2.0 and Communications Engine to implement routing, NAT and gateway services in compact designs.
• Modem/Routers — Single‑core processing with DMA and DDR2 support enables efficient packet handling and buffer management for consumer networking devices.
• Industrial Control — The PowerQUICC II Pro architecture and integrated interfaces support control and communication tasks in embedded automation and instrumentation systems.
• Test & Measurement — On‑chip peripherals and deterministic CPU behavior make the device suitable for networked test equipment and data acquisition controllers.

Unique Advantages

• Highly integrated communications processor: Combines an e300c3 core, Communications/QUICC Engine, Ethernet ports and USB in a single device to reduce BOM and PCB complexity.
• Balanced performance and efficiency: 266 MHz core with L1 caches and dual integer units delivers embedded processing capability while supporting low‑power system design goals noted in the product family brief.
• Flexible connectivity: Multiple 10/100 Mbps Ethernet interfaces plus USB 2.0 enable multiport network topologies and peripheral expansion without external controllers.
• Memory subsystem and DMA support: Integrated 16‑bit DDR2 controller and two DMA engines simplify high‑speed data movement and buffering for networking workloads.
• Compact production package: 369‑PBGA (19×19 mm) surface‑mount package minimizes board footprint for space‑constrained embedded systems.
• Documentation and family support: Part of the PowerQUICC II Pro family with detailed hardware specifications and design guidance available in the technical datasheet.

Why Choose MPC8306SVMADDCA?

The MPC8306SVMADDCA pairs an e300c3 PowerPC core with dedicated communications hardware and a robust peripheral set to deliver a focused solution for networking and embedded communications devices. Its integration of DDR2 memory support, multiple Ethernet ports, USB 2.0 and the QUICC Engine reduces external component count and streamlines system design.

This part is well suited for engineers developing compact gateways, routers, control modules and test equipment who require an established processor family, documented hardware characteristics and a production‑ready PBGA package. The device’s combination of integration, connectivity and vendor documentation supports design stability and long‑term product deployment.

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