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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8323EVRAFDCAMPC8323EVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
192
MPC8323EZQADDCMPC8323EZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,145
MPC8323EZQAFDCMPC8323EZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
107
MPC8323VRADDCMPC8323VRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
436
MPC8323VRADDCAMPC8323VRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,011
MPC8323VRAFDCMPC8323VRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
418
MPC8323VRAFDCAMPC8323VRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
407
MPC8323ZQADDCMPC8323ZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
433
MPC8323ZQAFDCMPC8323ZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
220
N/AMPC8343CRADDBNXP SemiconductorsPOWERQUICC II PRO PROCESSORMicroprocessors620-TEPBGA II (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-TEPBGA II (29×29)
308
MPC8343CVRADDMPC8343CVRADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,608
MPC8343CVRADDBMPC8343CVRADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
295
MPC8343CVRAGDMPC8343CVRAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
694
MPC8343CVRAGDBMPC8343CVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
460
MPC8343CZQADDMPC8343CZQADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
982
MPC8343CZQADDBMPC8343CZQADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,314
MPC8343CZQAGDBMPC8343CZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,160
MPC8343ECVRAGDBMPC8343ECVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,414
MPC8343ECZQADDBMPC8343ECZQADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
836
MPC8343ECZQAGDBMPC8343ECZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,561

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