MPC8343CRADDB

POWERQUICC II PRO PROCESSOR
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-TEPBGA II (29x29)

Quantity 308 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8343
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SECCore ProcessorPowerPC e300Device Package620-TEPBGA II (29x29)
ECCN3A991A2Ethernet10/100/1000Mbps (3)Graphics AccelerationNo
HTS Code0000.00.0000Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case620-BBGA Exposed PadRAM ControllersDDR, DDR2REACH ComplianceREACH not applicable
RoHS ComplianceNot applicableSecurity FeaturesCryptography, Random Number GeneratorSpeed266MHz
Supplier Device Package620-TEPBGA II (29×29)USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8343CRADDB – POWERQUICC II PRO PROCESSOR

The MPC8343CRADDB is a POWERQUICC II Pro microprocessor from NXP Semiconductors based on the PowerPC e300 core. It is a single‑core, 32‑bit device running at 266 MHz designed for embedded systems with integrated connectivity and security features.

Targeted at industrial embedded applications, the device combines on‑chip memory controllers, multi‑port Ethernet, USB interfaces and hardware security to deliver a compact, integrated processing solution for networked and secure embedded designs.

Key Features

  • Core Architecture PowerPC e300 32‑bit processor core operating at 266 MHz for deterministic embedded processing.
  • Memory Support Integrated controllers for DDR and DDR2 memory, enabling flexible external memory options for system design.
  • Security Subsystem Dedicated security co‑processor (SEC) with cryptography and a random number generator to support secure communications and data protection.
  • Networking & Interfaces Three 10/100/1000 Mbps Ethernet interfaces provide high‑density network connectivity for communication and gateway applications.
  • USB & Serial I/O Two USB 2.0 controllers with PHY and an additional DUART interface for peripheral connectivity and serial communications.
  • Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of −40 °C to 105 °C to meet harsh environment requirements.
  • Package & Mounting Supplied in a 620‑TEPBGA II (29×29) exposed‑pad package (620‑BBGA) for surface‑mount assembly and thermal management.
  • RoHS Compliance Device is RoHS compliant, supporting regulatory requirements for lead‑free assemblies.

Typical Applications

  • Industrial Networking Equipment — Multi‑port Gigabit Ethernet and industrial temperature rating make it suitable for switches, routers and protocol gateways used in industrial environments.
  • Security Appliances — On‑chip SEC, cryptography and a hardware random number generator enable secure communications and encryption tasks in networked security devices.
  • Embedded Control Systems — The PowerPC e300 core with DDR/DDR2 memory support is well suited for real‑time control and management in industrial automation and instrumentation.
  • Communication Gateways — Combined Ethernet, USB and DUART interfaces facilitate protocol conversion and edge gateway applications that require multiple peripheral connections.

Unique Advantages

  • Integrated Connectivity: Three Gigabit Ethernet ports plus dual USB 2.0 with PHY reduce external interface components and simplify board layout.
  • Built‑in Security Engine: SEC co‑processor with cryptography and RNG provides hardware acceleration for secure data handling and authentication.
  • Industrial‑Grade Operation: −40 °C to 105 °C operating range and industrial qualification support reliable operation in demanding environments.
  • Flexible Memory Options: DDR and DDR2 memory controller support allows designers to choose memory configurations to match performance and cost targets.
  • Compact Thermal Package: 620‑TEPBGA II (29×29) exposed‑pad package supports surface‑mount assembly and thermal dissipation for dense embedded designs.

Why Choose MPC8343CRADDB?

The MPC8343CRADDB delivers a balanced combination of processing capability, integrated I/O and hardware security in a single, industrially qualified PowerPC e300‑based device from NXP Semiconductors. Its multi‑port Ethernet, dual USB and dedicated security engine make it a practical choice for networked embedded systems that require on‑board connectivity and data protection.

This part is suited to designers building industrial networking equipment, secure gateways and control systems who need a compact, RoHS‑compliant processor solution with a broad feature set and industrial temperature operation.

If you would like pricing, availability or a formal quote for MPC8343CRADDB, submit a request or contact sales to initiate a quote or place an order.

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