MPC8343ECZQAGDB
| Part Description |
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 620-HBGA (29x29) |
|---|---|
| Quantity | 1,561 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8343 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC | Core Processor | PowerPC e300 | Device Package | 620-HBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10/100/1000Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 620-BBGA Exposed Pad | RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography, Random Number Generator | Speed | 400MHz | ||
| Supplier Device Package | 620-HBGA (29×29) | USB | USB 2.0 + PHY (2) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MPC8343ECZQAGDB – PowerPC e300 400 MHz 1‑Core 32‑Bit MPU (620‑HBGA)
The MPC8343ECZQAGDB is a single‑core PowerPC e300 microprocessor operating at 400 MHz, part of the PowerQUICC II Pro family of integrated host processors. It combines a Power Architecture® processor core with system logic tailored for networking, storage and general‑purpose embedded applications.
Designed for industrial applications, the device integrates DDR/DDR2 memory controllers, hardware security acceleration, multiple high‑speed network interfaces and USB connectivity in a compact 620‑HBGA (29×29) package with an exposed pad. It is RoHS compliant and rated for an operating temperature range of -40 °C to 105 °C.
Key Features
- Core PowerPC e300 processor core; single 32‑bit core running at 400 MHz.
- Memory Integrated controllers for DDR and DDR2 SDRAM to support system memory interfaces.
- Security On‑chip security engine (SEC) with cryptography acceleration and a hardware random number generator.
- Ethernet Three 10/100/1000 Mbps Ethernet interfaces for multi‑port networking and high‑throughput communications.
- USB Two USB 2.0 controllers with integrated PHY for host/device connectivity.
- Peripherals & Interfaces Includes DUART and additional peripheral interfaces for embedded control and I/O.
- Package & Mounting Supplier device package: 620‑HBGA (29×29); package case listed as 620‑BBGA with exposed pad; surface‑mount mounting type.
- Qualification & Temperature Industrial qualification with an operating temperature range of -40 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- Networking Equipment — Multi‑port Ethernet and integrated system logic make this device suitable for routers, switches and network appliances.
- Storage Systems — On‑chip controllers and high‑speed interfaces support embedded storage controllers and NAS applications.
- General‑Purpose Embedded Systems — The integrated peripherals and memory controllers enable varied embedded designs that require a balanced CPU and I/O feature set.
- Industrial Control & Communications — Industrial qualification and extended temperature range support deployment in factory automation and industrial communications equipment.
Unique Advantages
- Highly integrated platform: Combines CPU, memory controllers, multiple Ethernet ports, USB and peripheral interfaces to reduce board‑level complexity.
- Hardware security acceleration: Built‑in SEC engine, cryptography support and a random number generator provide on‑chip security functions without offload to external components.
- Flexible memory support: Native DDR and DDR2 SDRAM controllers simplify memory subsystem design across performance points.
- Multiple high‑speed interfaces: Three 10/100/1000 Mbps Ethernet controllers plus two USB 2.0 ports enable robust connectivity for communication and I/O expansion.
- Industrial readiness: Industrial qualification and a -40 °C to 105 °C operating range make the device suitable for harsh environments.
- Compact BGA packaging: 620‑HBGA (29×29) footprint with exposed pad supports dense board layouts and thermal management.
Why Choose MPC8343ECZQAGDB?
The MPC8343ECZQAGDB provides a balanced combination of processing, security and connectivity in a single integrated device. Its PowerPC e300 core, integrated memory controllers and multiple high‑speed interfaces make it well suited for embedded designs that require networking and storage capabilities alongside hardware security features.
This industrial‑qualified MPU is appropriate for designers targeting networking equipment, storage controllers and general‑purpose embedded systems that demand a compact package, extended temperature operation and reduced BOM through integration. The platform aligns with applications needing deterministic embedded processing with on‑chip peripheral support and vendor documentation for system design.
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