MPC8343ECZQADDB

IC MPU MPC83XX 266MHZ 620HBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-HBGA (29x29)

Quantity 836 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8343
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SECCore ProcessorPowerPC e300Device Package620-HBGA (29x29)
ECCN5A002A1 FREEthernet10/100/1000Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case620-BBGA Exposed PadRAM ControllersDDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed266MHz
Supplier Device Package620-HBGA (29×29)USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8343ECZQADDB – IC MPU MPC83XX 266MHZ 620HBGA

The MPC8343ECZQADDB is an embedded microprocessor based on the PowerPC e300 core, delivering single‑core 32‑bit processing at 266 MHz. It integrates system logic tailored for networking, storage and general‑purpose embedded applications, providing a compact, industrial‑qualified building block for robust designs.

Key Features

  • Core  PowerPC e300 single 32‑bit core running at 266 MHz for deterministic embedded processing.
  • Memory  On‑chip support for DDR and DDR2 memory controllers to enable flexible system memory configurations.
  • Security  Integrated security engine (SEC) with cryptography and a hardware random number generator for secure data handling.
  • Networking  Three‑speed Ethernet capable of 10/100/1000 Mbps (3 ports) and MII management for Ethernet‑centric applications.
  • USB  Dual USB 2.0 controllers with PHY support for host or device connectivity.
  • Peripheral Interfaces  Includes DUART and a broad set of system interfaces referenced in the product documentation (PCI, I2C, SPI, JTAG, GPIO, timers and local bus are documented in the hardware specification).
  • Package & Mounting  620‑HBGA (29 × 29 mm) package with exposed pad; surface‑mount mounting for compact board designs.
  • Qualification & Environmental  Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Networking Equipment  Designed for routers, switches and network appliances requiring integrated Ethernet ports and host processing.
  • Storage Gateways  Suitable for storage and gateway controllers that need DDR/DDR2 memory interfaces and high‑throughput peripheral connectivity.
  • Industrial Embedded Systems  Fits industrial controllers and embedded appliances that require an industrial temperature range and reliable, compact packaging.
  • General‑Purpose Embedded Hosts  Useful as an integrated host processor for embedded applications needing USB, serial DUART and diverse peripheral support.

Unique Advantages

  • Integrated Networking Peripherals: Multiple Ethernet ports and MII management reduce external components and simplify board design for networked products.
  • Hardware Security Acceleration: On‑chip SEC with cryptography and an RNG provides dedicated security capabilities without adding external crypto ICs.
  • Memory Flexibility: DDR and DDR2 controller support enables a range of memory configurations to match performance and cost targets.
  • Industrial Temperature Range: Rated for −40 °C to 105 °C, making it suitable for demanding environmental conditions.
  • Compact, High‑Pin Package: 620‑HBGA (29×29) with exposed pad offers a high‑density solution for space‑constrained boards while supporting thermal management.
  • Standards‑Oriented I/O: USB 2.0 with PHY and documented peripheral interfaces streamline integration with common system components.

Why Choose MPC8343ECZQADDB?

The MPC8343ECZQADDB combines a PowerPC e300 single‑core processor with integrated networking, security and memory controller capabilities in a single 620‑HBGA package, positioning it for embedded designs that demand integration, industrial qualification and solid peripheral support. It is appropriate for engineers building networked, storage or industrial systems who need a compact, industrial‑rated processor solution backed by NXP’s MPC8343 series documentation.

With on‑chip security, multi‑speed Ethernet, USB connectivity and DDR/DDR2 memory support, this part enables streamlined system architectures that reduce external BOM and simplify board layout while meeting industrial temperature requirements.

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