 | | XOMAP3503BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 1,625 | |
 | | XOMAP3515BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 476 | |
 | | XOMAP3525BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 597 | |
 | | XOMAP3530BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 120 | |
| N/A | | XOMAPL137AZKB3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 256BGA | Microprocessors | 256-BGA | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 776 | |
 | | XOMAPL137BZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 53 | |
 | | XOMAPL137DZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 53 | |
 | | XOMAPL138ZCE | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (13×13) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 56 | |
 | | XOMAPL138ZWT | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (16×16) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 348 | |
 | | XRM41L232PZT | Texas Instruments | IC MCU 16/32B 128KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Connectivity: CANbus, LINbus, MibSPI, SCI, SPI, UART/USART Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 362 | |
 | | XRM42L432PZT | Texas Instruments | IC MCU 16/32B 384KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Connectivity: CANbus, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,332 | |
 | | XRM44L520APZT | Texas Instruments | IC MCU 32BIT 768KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 208 | |
 | | XRM46L852PGET | Texas Instruments | IC MCU 16/32BIT 1.25MB 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,512 | |
 | | XRM48L950PGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 326 | |
 | | XRM48L950ZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,269 | |
 | | XRM48L952PGET | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 830 | |
 | | XRM48L952ZWTT | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,880 | |
 | | XRM57L843ZWTT | Texas Instruments | IC MCU 32BIT 4MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 57×10/12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,127 | |
| N/A | | XWL1801MODGAMOCT | Texas Instruments | IC RF TXRX BLUETOOTH 130FLGA | RF Transceiver ICs | 100-LGA (13.4x13.3) | 2.9V ~ 4.8V | -40°C ~ 85°C | RF Family/Standard: Bluetooth Voltage – Supply: 2.9V ~ 4.8V Current – Transmitting: 420mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 100-FLGA Module Supplier Device Package: 100-LGA (13.4×13.3) | 901 | |
| N/A | | XWL1805MODGAMOCT | Texas Instruments | IC RF TXRX BLUETOOTH 130FLGA | RF Transceiver ICs | 100-LGA (13.4x13.3) | 2.9V ~ 4.8V | -40°C ~ 85°C | RF Family/Standard: Bluetooth Voltage – Supply: 2.9V ~ 4.8V Current – Transmitting: 420mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 100-FLGA Module Supplier Device Package: 100-LGA (13.4×13.3) | 1,287 | |