| N/A | | TSPC603RVGH12LC | Microchip Technology | IC MPU 603E 266MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 10 | |
| N/A | | TSPC603RVGH8LC | Microchip Technology | IC MPU 603E 200MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 1,151 | |
| N/A | | TSPC603RVGS10LC | Microchip Technology | IC MPU 603E 233MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 57 | |
| N/A | | TSPC603RVGS12LC | Microchip Technology | IC MPU 603E 266MHZ 255CICBGA | Microprocessors | 255-CI-CGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Supplier Device Package: 255-CI-CGA (21×21) | 505 | |
| N/A | | TSPC603RVGS6LC | Microchip Technology | IC MPU 603E 166MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 1,703 | |
| N/A | | TSPC603RVGS8LC | Microchip Technology | IC MPU 603E 200MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 190 | |
| N/A | | TSPC603RVGU10LC | Microchip Technology | IC MPU 233MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 132 | |
| N/A | | TSPC603RVGU12LC | Microchip Technology | IC MPU 266MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 1,234 | |
| N/A | | TSPC603RVGU8LC | Microchip Technology | IC MPU 200MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 608 | |
 | | TSS521D | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | -25°C ~ 85°C | Number of Drivers/Receivers: 1/1 Operating Temperature: -25°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,844 | |
 | | TSS521DR | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | -25°C ~ 85°C | Number of Drivers/Receivers: 1/1 Operating Temperature: -25°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,560 | |
 | | TSS721AD | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | 0°C ~ 70°C | Number of Drivers/Receivers: 1/1 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,311 | |
 | | TSS721ADR | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | 0°C ~ 70°C | Number of Drivers/Receivers: 1/1 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 816 | |
| N/A | N/A | TST200A-32LQXI | Infineon Technologies | IC MCU TRUETOUCH | Microcontrollers | - | N/A | – | N/A | 1,289 | |
| N/A | N/A | TST200A-32LQXIT | Infineon Technologies | IC MCU TRUETOUCH | Microcontrollers | - | N/A | – | N/A | 271 | |
| N/A | | TSXPC860SRVZQU66D | Microchip Technology | IC MPU 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 110°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 655 | |
| N/A | N/A | TT21100-44LQI28 | Infineon Technologies | IC MCU 32BIT 44QFN | Microcontrollers | 44-QFN (5x5) | N/A | – | Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Mounting Type: Surface Mount Supplier Device Package: 44-QFN (5×5) Package / Case: 44-UFQFN Exposed Pad | 522 | |
| N/A | N/A | TT21100-44LQI28T | Infineon Technologies | IC MCU 32BIT 44QFN | Microcontrollers | 44-QFN (5x5) | N/A | – | Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Mounting Type: Surface Mount Supplier Device Package: 44-QFN (5×5) Package / Case: 44-UFQFN Exposed Pad | 238 | |
| N/A | N/A | TT21100-44LQI35 | Infineon Technologies | IC MCU 32BIT 44QFN | Microcontrollers | 44-QFN (5x5) | N/A | – | Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Mounting Type: Surface Mount Supplier Device Package: 44-QFN (5×5) Package / Case: 44-UFQFN Exposed Pad | 126 | |
| N/A | N/A | TT21100-48LQI36 | Infineon Technologies | IC MCU 32BIT 48QFN | Microcontrollers | 48-QFN (6x6) | N/A | – | Core Processor: ARM® Cortex® Core Size: 32-Bit Single-Core Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Mounting Type: Surface Mount Supplier Device Package: 48-QFN (6×6) Package / Case: 48-UFQFN Exposed Pad | 550 | |