UBC1H330MNS1GS

CAP ALUM 33UF ±20% 50V SMD
Part Description

33 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,226 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUBC
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)1.1 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 150°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 150°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency70 mA @ 10 kHzRipple Current Low Frequency46.9 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage50 V

Overview of UBC1H330MNS1GS – Aluminum Electrolytic Chip Capacitor, 33 µF 50 V

The UBC1H330MNS1GS is a surface-mount aluminum electrolytic chip capacitor from Nichicon’s UBC series, specified for high-temperature, vibration-resistant applications. It delivers 33 µF capacitance at a 50 V rating with ±20% tolerance in a compact φ8×10 mm chip package.

Designed for demanding environments, this part combines a wide operating temperature range (−40°C to +150°C) and a 1000-hour endurance at +150°C, making it suitable for automotive electronics and other assemblies requiring long-term high-temperature performance and vibration resistance.

Key Features

  • Electrical characteristics — 33 µF capacitance at 50 V with ±20% tolerance, tan δ ≤ 0.14 (120 Hz, 20°C), and specified leakage current of 49.5 µA after 1 minute at 20°C.
  • Ripple performance — Low-frequency ripple current of 46.9 mA at 120 Hz and high-frequency ripple capability of 70 mA at 10 kHz, supporting stable operation in filtered and power-supply circuits.
  • High-temperature endurance — Rated to operate from −40°C to +150°C with an endurance rating of 1000 hours at +150°C.
  • Package and mounting — Chip-type surface-mount construction in a φ8×10 mm (L: 1.0 cm × D: 0.8 cm) can; recommended PCB land size 8.3 × 8.3 mm for reliable placement.
  • Reliability and vibration resistance — UBC chip design provides vibration resistance suitable for assemblies exposed to mechanical stress.
  • Production-ready handling — Available in embossed carrier taping for automated placement; specified for mass production.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Automotive electronics — Suited for automobile electronics where heavy-duty, high-temperature service and vibration resistance are required.
  • High-temperature electronic assemblies — Components and modules that must withstand sustained temperatures up to +150°C while maintaining capacitance and leakage specifications.
  • Vibration-prone systems — Surface-mount designs where mechanical shock and vibration resistance are important for long-term reliability.

Unique Advantages

  • High-temperature durability: 1000-hour rated life at +150°C provides predictable performance in elevated-temperature environments.
  • Automotive-grade qualification: AEC-Q200 rating and explicit suitability for automobile electronics support use in demanding vehicular applications.
  • Compact SMD form factor: φ8×10 mm chip construction and standard land pattern (8.3 × 8.3 mm) enables space-efficient PCB layout and automated assembly.
  • Low dissipation and leakage: tan δ ≤ 0.14 and 49.5 µA leakage current help maintain efficiency and low loss in power circuits.
  • Production-ready packaging: Embossed carrier taping and mass-production availability reduce handling overhead and streamline volume assembly.
  • Regulatory compliance: RoHS compliance for environmentally conscious product development.

Why Choose UBC1H330MNS1GS?

UBC1H330MNS1GS is positioned for engineers and procurement teams specifying capacitors for high-temperature, vibration-exposed environments, particularly in automotive electronics. Its combination of 33 µF/50 V electrical performance, proven endurance at +150°C, and AEC-Q200 qualification make it a reliable choice where sustained performance and regulatory compliance matter.

Delivered in an SMD chip package with embossed carrier taping for automated placement, this part supports production-scale assembly while providing verifiable electrical and thermal performance that designers can trust for long-term deployments.

Request a quote or contact sales to discuss pricing, lead times, and sample availability for UBC1H330MNS1GS.

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