| N/A | N/A | KGD-64Mbx16/-128Mbx8-DDR-II-SDRAM-1.8V | ESMT | DDR2 SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 64M x 16 / 128M x 8 Memory Interface: Parallel | 617 | |
| N/A | N/A | KGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5V | ESMT | DDR3 SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 64M x 16 / 128M x 8 Memory Interface: Parallel | 749 | |
| N/A | N/A | KGD-64Mbx32-LPDDR2-SDRAM-1.2V/1.8V | ESMT | LPDDR2 SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 64M x 32 Memory Interface: Parallel | 238 | |
| N/A | N/A | KGD-64Mbx32-LPDDR3-SDRAM-1.2V | ESMT | LPDDR3 SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 64M x 32 Memory Interface: Parallel | 1,031 | |
| N/A | N/A | KGD-8Mbx16-DDR-II-SDRAM-1.8V | ESMT | DDR2 SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 16 Memory Interface: Parallel | 159 | |
| N/A | N/A | KGD-8Mbx16-DDR-SDRAM-1.8V/2.5V | ESMT | DDR SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 16 Memory Interface: Parallel | 1,523 | |
| N/A | N/A | KGD-8Mbx16-SDRAM-1.8V/2.5V/3.3V | ESMT | SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 16 Memory Interface: Parallel | 156 | |
| N/A | N/A | KGD-8Mbx32-LPDDR-SDRAM-1.8V | ESMT | LPDDR SDRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 32 Memory Interface: Parallel | 218 | |
| N/A | N/A | KGD-8Mbx8-PSRAM,-1.8V | ESMT | PSRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 8 Memory Interface: Parallel | 673 | |
| N/A | N/A | KGD-8Mbx8-PSRAM,-2.7~3.6V | ESMT | PSRAM KGD | DRAM Memory | N/A | 2.5V | N/A | Write Cycle Time Word Page: N/A Memory Organization: 8M x 8 Memory Interface: Parallel | 874 | |
| N/A | N/A | KKL15Z128CAD4R | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 35WLCSP | Microcontrollers | 35-WLCSP (2.53x2.99) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x16b; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 35-WLCSP (2.53×2.99) Package / Case: 35-UFBGA, WLCSP | 1,574 | |
| N/A | N/A | KLM4G1FETE-B041 | Samsung Semiconductor, Inc. | 4GB eMMC v5.1, -25 ~ 85 C , HS40 | eMMC Memory | N/A | 1.8V ~ 3.3V | -25°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 32 x 8 Write Cycle Time Word Page: N/A | 1,438 | |
 | | KMC68302EH25C | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 101 | |
 | | KMC68360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 1,805 | |
 | | KMC68360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 361 | |
 | | KMC68EN302AG25BT | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 905 | |
 | | KMC68EN360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 1,095 | |
 | | KMC68EN360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 805 | |
| N/A | | KMC68EN360RC33L | NXP Semiconductors | IC MPU M683XX 33MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 781 | |
 | | KMC68EN360VR25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,048 | |