KMC68EN302AG25BT

The KMC68EN302AG25BT is an NXP Semiconductors MC68 series microprocessor featuring a microcoded M68000 core with a single 8/16-bit bus and a 25 MHz clock. It integrates communications-focused peripherals including an Ethernet controller and a DRAM controller, making it suitable for embedded applications that require on-chip networking and memory support.

Designed for embedded systems, the device delivers a compact, surface-mount 144-LQFP (20×20 mm) package, 5 V I/O levels and an operating range of 0 °C to 70 °C, providing a practical balance of performance and integration for mid-range networking and communications designs.

Key Features

• Core  M68000 microcoded processor core, single core with an 8/16-bit bus width and a 25 MHz operating speed.
• Integrated Ethernet  IEEE 802.3–compatible Ethernet controller with a 16-bit interface to the 68000 bus. Supports up to 10 Mb/s operation and includes dedicated transmit and receive DMA channels, separate 128-byte FIFOs, and on-chip buffer descriptors.
• Memory and DMA  On-chip DRAM controller with support for parity and external bus masters, a dual-port RAM for buffer descriptors, and multiple DMA channels to offload data movement from the CPU.
• Communications Peripherals  Includes three SCCs plus an Ethernet channel, a microcoded communications controller (RISC CPM), serial channels and additional communications interfaces (GCI).
• System and Debug  Fully IEEE 1149.1 JTAG compliant for boundary-scan and system-level debug.
• Package and Environmental  144-LQFP (20×20 mm) surface-mount package, RoHS compliant, specified for 0 °C to 70 °C operating temperature and 5 V I/O.

Typical Applications

• Embedded Networking  On-chip Ethernet and DMA reduce host CPU overhead for networked embedded controllers and gateway devices.
• Communications Equipment  Integrated SCCs, CPM and serial interfaces suit protocol handling, channel control and communications processing tasks.
• Memory-Intensive Control  DRAM controller, dual-port RAM and multiple DMA channels support designs that require buffering and sustained data throughput.
• Industrial and Commercial Embedded Systems  Surface-mount 144-LQFP packaging and standard 5 V I/O make the device appropriate for a range of mid-temperature embedded control applications.

Unique Advantages

• Highly integrated communications stack: Ethernet controller, SCCs and a communications RISC (CPM) on-chip reduce external component count and simplify board design.
• CPU offload via DMA and FIFOs: Dedicated Ethernet DMA channels and 128-byte transmit/receive FIFOs minimize processor intervention for network traffic.
• Robust memory support: DRAM controller with parity support and external bus master addressing options enable reliable system memory implementations.
• Standard surface-mount package: 144-LQFP (20×20 mm) offers a compact footprint for space-constrained embedded designs.
• Design-for-test support: IEEE 1149.1 JTAG compliance facilitates boundary-scan testing and system debug.
• Regulatory and supply readiness: RoHS compliant construction supports modern manufacturing and environmental requirements.

Why Choose KMC68EN302AG25BT?

The KMC68EN302AG25BT combines an M68000 microcoded core with integrated Ethernet and DRAM controllers to deliver a focused solution for embedded networking and communications applications. Its on-chip peripherals and DMA architecture reduce system complexity and offload routine data handling from the CPU, enabling more efficient use of processing resources.

This device is appropriate for designers seeking a compact, surface-mount microprocessor with built-in networking and memory interfaces at a 25 MHz performance point, specified I/O voltage of 5 V and a commercial temperature range of 0 °C to 70 °C.

Request a quote or submit a purchase inquiry today to evaluate KMC68EN302AG25BT for your embedded networking or communications design needs.