KMC68360CAI25L

IC MPU M683XX 25MHZ 240FQFP
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32)

Quantity 943 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package240-FQFP (32x32)
ECCN3A991A2Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case240-BFQFPRAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package240-FQFP (32×32)
Voltage – I/O5.0V

Overview of KMC68360CAI25L – IC MPU M683XX 25MHZ 240FQFP

The KMC68360CAI25L is a CPU32+ microprocessor from NXP Semiconductors' MC68360 series, featuring a single 32-bit core running at 25 MHz. It integrates communications-focused co-processing and system integration functionality in a compact surface-mount package for embedded designs.

Designed within the MC68360 QUICC (QUad Integrated Communications Controller) architecture, this device targets embedded communications and industrial control segments where integrated communications peripherals, deterministic operation, and industrial temperature qualification are important.

Key Features

  • CPU Core: CPU32+ single 32‑bit core operating at 25 MHz for deterministic embedded control and processing.
  • Communications Co‑processing: Built‑in Communications Processor Module (CPM) and communications DSP capabilities to offload serial and protocol handling from the main CPU.
  • Memory Interface: Integrated DRAM controller support to interface with external DRAM memory for system data and code storage.
  • Networking Capability: Integrated 10 Mbps Ethernet interface (1) for basic network connectivity in control and communications applications.
  • Serial Interfaces: Additional Serial Communications Controller (SCC) interfaces for protocol and serial peripheral connectivity.
  • Power and I/O: 5 V I/O voltage compatible with legacy 5 V logic domains.
  • Industrial Qualification: Qualified for industrial use with an operating temperature range of −40 °C to 85 °C for reliable operation in harsh environments.
  • Package and Mounting: 240‑pin FQFP (32 × 32 mm) surface‑mount package for high‑pin‑count integration in compact PCBs.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • Embedded Communications Controllers: Use the integrated CPM and SCC interfaces to implement protocol handling and serial communications in embedded networking devices.
  • Industrial Control Systems: Industrial‑qualified temperature range and deterministic CPU32+ core make it suitable for control logic and I/O aggregation in factory automation.
  • Network Gateways and Interface Modules: Integrated 10 Mbps Ethernet and serial interfaces enable gateway functions between legacy serial equipment and Ethernet networks.
  • System Upgrades and Retrofits: 5 V I/O and the MC68360 family architecture support replacement or upgrade of legacy designs that require communications integration.

Unique Advantages

  • Integrated Communications Engine: The CPM and communications DSP capabilities reduce external peripheral requirements and simplify protocol implementations.
  • Industrial Temperature Range: Rated from −40 °C to 85 °C to support deployment in demanding environmental conditions.
  • 32‑Bit CPU32+ Core: A 32‑bit core at 25 MHz delivers predictable, deterministic processing for embedded control tasks.
  • Compact High‑Pin‑Count Package: 240‑pin FQFP (32 × 32 mm) enables dense peripheral connectivity while remaining surface‑mount friendly for production assembly.
  • Onboard DRAM Controller: Built‑in DRAM controller simplifies memory subsystem design and supports local data/code storage needs.
  • RoHS Compliant: Meets lead‑free environmental requirements for modern manufacturing processes.

Why Choose KMC68360CAI25L?

The KMC68360CAI25L positions itself as a compact, communications‑oriented microprocessor for embedded and industrial designs that require integrated protocol handling and reliable operation across a wide temperature range. Its CPU32+ core combined with a Communications Processor Module and DRAM controller offers a focused balance of processing and communications capability in a single device.

Engineers choosing the KMC68360CAI25L benefit from the MC68360 documentation and architecture resources, industrial qualification, and a package optimized for systems requiring multiple peripheral connections and robust environmental performance.

Request a quote or submit a purchasing inquiry to receive pricing and availability for the KMC68360CAI25L.

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