KMC68EN360VR25VL
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 222 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | EAR99 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 70°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 25MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of KMC68EN360VR25VL – IC MPU M683XX 25MHZ 357BGA
The KMC68EN360VR25VL is a CPU32+ microprocessor from NXP Semiconductors' MC68 series, featuring a single 32-bit core running at 25 MHz. Designed for embedded systems, this device integrates communications-focused co-processing and DRAM controller capabilities to support control and communications tasks.
Key attributes include a CPU32+ core architecture, a Communications Processor Module (CPM) for communications handling, 3.3 V I/O signaling, and a compact 357-PBGA (25 × 25 mm) surface-mount package, all supplied in a RoHS-compliant form.
Key Features
- CPU Core – CPU32+ 32-bit Single 32-bit CPU32+ core operating at 25 MHz for deterministic embedded processing.
- Communications Co-Processing – CPM Integrated Communications Processor Module (CPM) for offloading communications tasks and protocol handling.
- Memory Support – DRAM Controller On-chip DRAM controller support to interface with external memory for system data and code storage.
- Ethernet Single 10 Mbps Ethernet interface for basic network connectivity and embedded communications.
- Additional Interfaces – SCC Serial Communication Controller (SCC) interfaces for serial peripheral and point-to-point communications.
- Power and Signaling 3.3 V I/O voltage for compatibility with common embedded logic levels.
- Package and Mounting 357‑PBGA (25 × 25 mm) supplier device package, surface-mount mounting for compact board designs.
- Operating Range Rated for operation from 0 °C to 70 °C and supplied as RoHS compliant.
Typical Applications
- Embedded Communications Controllers Use the integrated CPM and SCC interfaces to implement embedded communications and protocol handling.
- Networked Embedded Devices Leverage the 10 Mbps Ethernet interface for basic network connectivity in control and monitoring systems.
- System Control Modules Employ the CPU32+ core and DRAM controller for general-purpose control, data buffering, and system management tasks.
Unique Advantages
- Integrated Communications Processing: The included CPM reduces software overhead for communications tasks by providing dedicated hardware support.
- Single 32-bit Core Simplicity: A single CPU32+ core simplifies software partitioning and deterministic control in embedded applications.
- Memory Interface Support: On-chip DRAM controller support streamlines external memory integration for larger code and data requirements.
- Compact Surface-Mount Package: The 357‑PBGA (25 × 25 mm) package enables high-density board layouts while preserving signal routing options.
- Standard I/O Voltage: 3.3 V I/O compatibility facilitates integration with common modern peripherals and logic families.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for lead-free production.
Why Choose KMC68EN360VR25VL?
The KMC68EN360VR25VL combines a CPU32+ core with dedicated communications co-processing, DRAM controller support, and serial/Ethernet interfaces to deliver a focused solution for embedded communications and control designs. Its 3.3 V I/O and compact 357‑PBGA package make it suitable for space-conscious, surface-mount applications.
This device is appropriate for teams building embedded systems that require integrated communications support and deterministic 32-bit processing within the specified 0 °C to 70 °C operating range, backed by NXP Semiconductors' MC68 series documentation and RoHS compliance.
Request a quote or submit an RFQ to begin procurement and integration of the KMC68EN360VR25VL for your embedded communications and control projects.

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