KMC68MH360AI33L

The KMC68MH360AI33L is a CPU32+ microprocessor from the MC68 series featuring a single 32‑bit core running at 33 MHz in a 240‑FQFP (32×32) surface‑mount package. It combines a CPU32+ core with on‑chip communications and system integration features to support embedded controller applications.

Designed for embedded and communications‑centric systems, the device offers integrated communications co‑processing (CPM), multiple serial channels, DRAM controller support and optional 10 Mbps Ethernet capability, delivering a compact platform for networked embedded designs within a 0 °C to 70 °C operating range. The device is RoHS compliant.

Key Features

• Core  CPU32+ core, single 32‑bit processor operating at 33 MHz for general embedded control and processing tasks.
• Memory and Boot  On‑chip memory interfaces including support for DRAM controllers and flexible boot chip‑select options for 8‑, 16‑ or 32‑bit memory configurations.
• Communications Co‑processor (CPM)  Integrated Communications Processor Module (CPM) provides a RISC controller with buffer descriptor support and commands for efficient serial channel handling.
• Serial Interfaces  Multiple serial channels from the QUICC family architecture: four SCCs, two SMCs and one SPI channel, providing broad protocol and serial connectivity options.
• Ethernet  10 Mbps Ethernet support is identified in the product series; Ethernet is available on SCC1 for applicable device variants.
• DMA and Timers  Two independent DMA controllers with buffer chaining and auto‑buffer modes plus four general‑purpose timers (configurable as 16‑bit or 32‑bit) for deterministic I/O and timing.
• System Integration  On‑chip System Integration Module (SIM60) features bus monitoring, watchdog, breakpoint logic, periodic interrupt timer and on‑chip bus arbitration for embedded system control.
• Package & Mounting  240‑lead FQFP (32×32 mm) surface‑mount package suitable for high‑pin‑count embedded designs.
• Power and Environmental  5 V I/O voltage and an operating temperature range of 0 °C to 70 °C. RoHS compliant.

Typical Applications

• Embedded Communications Controllers  Use the integrated CPM and multiple serial channels to implement protocol handling, HDLC/SDLC link control and serial communications offload.
• Networked Control Systems  Leverage the optional 10 Mbps Ethernet support and SCC channels for compact network gateways, protocol converters and remote controllers.
• Industrial and Automation Equipment  Apply the device’s timers, DMA and DRAM interface support for deterministic I/O, buffering and real‑time control tasks in factory automation controllers.
• Embedded System Integration  Utilize the SIM60 features (watchdog, bus monitor, breakpoints) for robust system management and simplified board‑level integration.

Unique Advantages

• Highly integrated QUICC architecture: Combines CPU32+ processing with communications peripherals and system logic to reduce component count and simplify board design.
• Communications‑focused processing: CPM and multiple serial channels enable offload of communication tasks from the CPU, improving system determinism.
• Flexible memory interfacing: DRAM controller support and multiple memory width options allow tailored memory configurations for buffering and code storage.
• Deterministic I/O and timing: Independent DMA channels and configurable timers provide efficient data movement and precise timing control for embedded applications.
• High pin‑count surface mount package: 240‑FQFP (32×32) package delivers the I/O density needed for complex embedded systems while supporting surface‑mount assembly.
• Regulatory compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose KMC68MH360AI33L?

The KMC68MH360AI33L positions a CPU32+ core alongside the MC68/QUICC‑family communications and system integration features, offering a compact, integrated foundation for communications‑centric embedded designs. Its combination of serial channels, CPM capabilities, DMA, timers and DRAM interface support makes it well suited to controllers, gateways and networked embedded equipment that require on‑chip communications handling and reliable system management.

Manufactured by NXP Semiconductors and provided in a 240‑lead FQFP surface‑mount package with RoHS compliance, this device fits applications that demand high I/O density, flexible memory interfacing and standard ambient operating temperatures.

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