Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AKW45Z41082AFPBTNXP SemiconductorsK4W1 HVQFN40Microcontrollers40-HVQFN (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
96MHz
Connectivity:
CANbus, HMI, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
22
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x16b SAR
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
40-HVQFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
1,429
KW45Z41082AFTBTKW45Z41082AFTBTNXP SemiconductorsK4W1 HVQFN48Microcontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
96MHz
Connectivity:
CANbus, HMI, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
29
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x16b SAR
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
681
N/AKW45Z41083AFPBTNXP SemiconductorsK4W1 HVQFN40Microcontrollers40-HVQFN (6x6)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
96MHz
Connectivity:
CANbus, HMI, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
22
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x16b SAR
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
40-HVQFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
1,450
KW45Z41083AFTBTKW45Z41083AFTBTNXP SemiconductorsK4W1 HVQFN48Microcontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
96MHz
Connectivity:
CANbus, HMI, I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
29
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x16b SAR
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
598
N/AKX161CJ16F40FBBNTInfineon TechnologiesIC MCU 16BIT 128KB FLASHMicrocontrollers-N/A-40°C ~ 125°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
99
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 12×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
978
KX161CS32F40FBBANTKX161CS32F40FBBANTInfineon TechnologiesIC MCU 16BIT 256KB FLASH 144TQFPMicrocontrollersPG-TQFP-144-7N/A-40°C ~ 125°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
99
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.7V
Data Converters:
A/D 12×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-144-7
Package / Case:
144-LQFP
1,201
KX228796F66L82ACXTKX228796F66L82ACXTInfineon TechnologiesIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollersPG-LQFP-144-4N/A-40°C ~ 125°C (TA)
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-LQFP-144-4
Package / Case:
144-LQFP Exposed Pad
1,269
KXPC823VR81B2TKXPC823VR81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,356
KXPC8240LVV200EKXPC8240LVV200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
586
KXPC8240RVV250EKXPC8240RVV250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
33
L293DNL293DNTAEJIN TechnologyMTRDRV BIPLR 4.5-36VMotor Drivers, ControllersDIP-16N/A0°C ~ 70°C (TA)
Operating Temperature:
0°C ~ 70°C (TA)
Supplier Device Package:
DIP-16
Packaging:
Tube
267
N/AL6360STMicroelectronicsIC TRANSCEIVER 1/1Drivers, Receivers, TransceiversN/A18V ~ 32.5V-25°C ~ 125°C
Type:
Transceiver
Protocol:
PHY2
Number of Drivers/Receivers:
1/1
Voltage – Supply:
18V ~ 32.5V
Operating Temperature:
-25°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
26-VFQFN Exposed Pad
128
L6360TRL6360TRSTMicroelectronicsIC TRANSCEIVER 1/1 26VFQFPNDrivers, Receivers, TransceiversN/A18V ~ 32.5V-25°C ~ 125°C
Type:
Transceiver
Protocol:
IO-Link
Number of Drivers/Receivers:
1/1
Voltage – Supply:
18V ~ 32.5V
Operating Temperature:
-25°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
26-VFQFN Exposed Pad
382
L6362AL6362ASTMicroelectronicsIC TRANSCEIVER 1/1 12VFDFPNDrivers, Receivers, Transceivers12-VFDFPN (3x3)7V ~ 36V-40°C ~ 125°C
Type:
Transceiver
Protocol:
IO-Link
Number of Drivers/Receivers:
1/1
Voltage – Supply:
7V ~ 36V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
12-VFDFN Exposed Pad
Supplier Device Package:
12-VFDFPN (3×3)
1,109
L6362ATRL6362ATRSTMicroelectronicsIC TRANSCEIVER 1/1 12VFDFPNDrivers, Receivers, Transceivers12-VFDFPN (3x3)7V ~ 36V-40°C ~ 125°C
Type:
Transceiver
Protocol:
IO-Link
Number of Drivers/Receivers:
1/1
Voltage – Supply:
7V ~ 36V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
12-VFDFN Exposed Pad
Supplier Device Package:
12-VFDFPN (3×3)
1,185
L6364QL6364QSTMicroelectronicsIC TRANSCEIVER FULL 2/2 20QFNDrivers, Receivers, Transceivers20-QFN (4x4)5V ~ 35V-40°C ~ 150°C
Type:
Transceiver
Protocol:
I/O-Link
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
1 V
Data Rate:
230.4Kbps
Voltage – Supply:
5V ~ 35V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
20-VFQFN Exposed Pad
Supplier Device Package:
20-QFN (4×4)
1,163
N/AL6364WSTMicroelectronicsIC TRANSCEIVER FULL 2/2 20QFNDrivers, Receivers, Transceivers20-QFN (4x4)4.5V ~ 35V, 6V ~ 35V-40°C ~ 150°C
Type:
Transceiver
Protocol:
I/O-Link
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
1 V
Data Rate:
230.4kBaud
Voltage – Supply:
4.5V ~ 35V, 6V ~ 35V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
20-VFQFN Exposed Pad
Supplier Device Package:
20-QFN (4×4)
66
L6451L6451STMicroelectronicsIC DRIVER 44PLCCDrivers, Receivers, Transceivers44-PLCC4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
44-LCC (J-Lead)
Supplier Device Package:
44-PLCC
365
L6451013TRL6451013TRSTMicroelectronicsIC DRIVER 44PLCCDrivers, Receivers, Transceivers44-PLCC4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
44-LCC (J-Lead)
Supplier Device Package:
44-PLCC
1,145
L9613BL9613BSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC3V ~ 7V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
250 mV
Voltage – Supply:
3V ~ 7V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
31

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up