Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
L9613B013TRL9613B013TRSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC3V ~ 7V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
250 mV
Voltage – Supply:
3V ~ 7V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
196
L9615DL9615DSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 110°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
150 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 110°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
81
L9615D013TRL9615D013TRSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 110°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
150 mV
Data Rate:
500kBd
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 110°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
639
L9616L9616STMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
150 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
229
L9616-TRL9616-TRSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
150 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,290
L9637DL9637DSTMicroelectronicsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 36V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
788
L9637D013TRL9637D013TRSTMicroelectronicsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 36V-40°C ~ 150°C
Type:
Transceiver
Protocol:
ISO 9141
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
747
L9638DL9638DSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC6V ~ 26V-40°C ~ 150°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Voltage – Supply:
6V ~ 26V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
190
L9638D013TRL9638D013TRSTMicroelectronicsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC6V ~ 26V-40°C ~ 150°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Voltage – Supply:
6V ~ 26V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,041
L9669013TRL9669013TRSTMicroelectronicsIC TRANSCEIVER HALF 1/1 14SODrivers, Receivers, Transceivers14-SO4.75V ~ 5.25V-40°C ~ 150°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SO
1,032
LA73050-MPB-EN/ALA73050-MPB-EonsemiIC VIDEO DRIVER 6CH 75 OHMDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,818
N/AN/ALA9520V-MPB-EonsemiIC RECEIVER AV COUPLERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

851
LAE3-17EA-6FN484ELAE3-17EA-6FN484ELattice Semiconductor CorporationIC FPGA 222 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
222
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
82
LAE3-17EA-6FTN256ELAE3-17EA-6FTN256ELattice Semiconductor CorporationIC FPGA 133 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
133
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
1,499
LAE3-17EA-6LFN484ELAE3-17EA-6LFN484ELattice Semiconductor CorporationIC FPGA 222 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
222
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
518
LAE3-17EA-6LFTN256ELAE3-17EA-6LFTN256ELattice Semiconductor CorporationIC FPGA 133 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
133
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
53
LAE3-17EA-6LMG328ELAE3-17EA-6LMG328ELattice Semiconductor CorporationIC FPGA 116 I/O 328CSBGAFPGAs328-CSBGA (10x10)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
116
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
1,606
LAE3-17EA-6MG328ELAE3-17EA-6MG328ELattice Semiconductor CorporationIC FPGA 116 I/O 328CSBGAFPGAs328-CSBGA (10x10)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
116
Number of LABs/CLBs:
2125
Number of Logic Elements/Cells:
17000
Qualification:
AEC-Q100
Total RAM Bits:
716800
143
LAE3-35EA-6FN484ELAE3-35EA-6FN484ELattice Semiconductor CorporationIC FPGA 295 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
295
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
33000
Qualification:
AEC-Q100
Total RAM Bits:
1358848
1,395
LAE3-35EA-6FN672ELAE3-35EA-6FN672ELattice Semiconductor CorporationIC FPGA 310 I/O 672FPBGAFPGAs672-FPBGA (27x27)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
310
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
33000
Qualification:
AEC-Q100
Total RAM Bits:
1358848
662

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