LAE3-17EA-6FN484E

The LAE3-17EA-6FN484E is a LA-ECP3 family FPGA optimized for automotive and embedded applications. It provides a reconfigurable logic fabric with 17,000 logic elements, approximately 0.72 Mbits of embedded memory, and 222 user I/Os in a 484-ball BGA (23×23) package.

Designed for system integration and reliability, this device is AEC-Q100 qualified, RoHS compliant, and specified for operation from -40 °C to 125 °C with a core supply range of 1.14 V to 1.26 V, making it suitable for demanding in-vehicle and harsh-environment designs.

Key Features

• Core Logic  17,000 logic elements provide programmable LUT-based logic for custom control, processing, and glue-logic implementations.
• Embedded Memory  Approximately 0.72 Mbits of on-chip RAM to support buffering, state machines, and data paths.
• I/O and Package  222 user I/Os in a 484-BBGA (23×23) package; surface-mount package suitable for compact board designs.
• Automotive Qualification & Reliability  Automotive grade with AEC-Q100 qualification and RoHS compliance; rated for -40 °C to 125 °C operation.
• Power  Core supply specified between 1.14 V and 1.26 V for predictable power budgeting and system design.
• Family-Level Capabilities (LA-LatticeECP3)  The LA-LatticeECP3 family includes advanced features such as embedded SERDES, a sysDSP slice architecture for high-performance multiply/accumulate, programmable sysI/O buffers supporting a wide range of standards, and flexible device configuration (SPI boot, dual-boot, soft error detect).
• System Support  Family-level support for IEEE 1149.1 and IEEE 1532, on-chip oscillator, and configuration utilities to streamline development and debugging.

Typical Applications

• In-vehicle networking  Leverage high I/O density and family SERDES capabilities to implement automotive communication interfaces and bridging functions.
• Infotainment and Telematics  Use the programmable logic and embedded memory to manage interfaces, data routing, and custom signal processing tasks.
• Sensor and Control Systems  Deploy the device in control and sensor aggregation nodes where automotive-grade qualification and extended temperature support are required.
• Industrial embedded systems  Take advantage of robust packaging, extended temperature range, and reconfigurable logic for factory automation or specialized protocol bridging.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 qualification and wide operating temperature range reduce validation effort for in-vehicle deployments.
• High I/O count in a compact package: 222 user I/Os in a 484-BBGA (23×23) enable dense interface routing while minimizing PCB footprint.
• Balanced compute and memory: 17,000 logic elements paired with approximately 0.72 Mbits of embedded RAM support a broad range of control and data-path functions without excessive external memory.
• Deterministic power envelope: Narrow core supply range (1.14–1.26 V) simplifies power-supply design and thermal planning.
• Family-level advanced peripherals: Access to LA-LatticeECP3 family features—such as sysDSP, SERDES, and flexible sysI/O—provides architectural options for higher-performance designs.

Why Choose LAE3-17EA-6FN484E?

The LAE3-17EA-6FN484E combines a mid-density FPGA fabric with automotive-grade qualification and a compact BGA package to address embedded system designs that require reconfigurable logic, broad I/O connectivity, and reliable operation across extended temperatures. Its balance of logic capacity, on-chip memory, and I/O count makes it well suited for connectivity, control, and data-handling functions in automotive and industrial applications.

Choosing this device offers predictable power requirements, AEC-Q100 qualification for automotive programs, and the option to leverage LA-LatticeECP3 family features for designs that may scale to higher integration or throughput needs.

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