LAE3-17EA-6LMG328E

The LAE3-17EA-6LMG328E is an AEC‑Q100 qualified, automotive-grade LA‑LatticeECP3 family Field Programmable Gate Array (FPGA) in a 328‑CSBGA (10×10) package. It provides 17,000 logic elements, 116 user I/Os and embedded memory suited for high‑performance, safety‑oriented and harsh‑environment applications.

Built on the LA‑LatticeECP3 architecture, the device targets high‑speed interfaces, DSP acceleration and flexible I/O requirements common in automotive, communications and video systems where temperature range, qualification and integration matter.

Key Features

• Logic Capacity — 17,000 logic elements for mid‑range FPGA integration and on‑chip logic implementation.
• Embedded Memory — Approximately 0.72 Mbits of on‑chip RAM (716,800 bits) to support buffers, FIFOs and local data storage.
• I/O and Package — 116 user I/Os in a 328‑LFBGA / CSBGA package (supplier device package: 328‑CSBGA, 10×10); surface mount mounting type.
• Automotive Qualification — AEC‑Q100 qualification and automotive grade designation, with operating temperature range of −40 °C to 125 °C.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V (1.2 V typical family core supply).
• High‑Speed Serial Connectivity (Family Features) — Family supports embedded SERDES with data rates from 150 Mbps up to 3.2 Gbps and up to four SERDES channels per device for protocols such as PCI Express, Ethernet and CPRI.
• Enhanced DSP and Memory Architecture (Family Features) — sysDSP slice architecture and flexible embedded block RAM options across the LA‑LatticeECP3 family for multiply‑accumulate and signal processing tasks.
• Flexible I/O Standards (Family Features) — Programmable I/O buffers across the family support a wide range of standards including LVDS, SSTL, HSTL and LVCMOS variants and dedicated source synchronous interfaces for DDR memory.
• Compliance and Tooling (Family Features) — Family supports IEEE 1149.1 and IEEE 1532, Reveal Logic Analyzer and configuration options such as SPI boot and dual‑boot images.
• RoHS — Device is RoHS compliant.

Typical Applications

• Automotive Systems — In‑vehicle processing, sensor fusion and domain controllers that require AEC‑Q100 qualification and wide operating temperature capability.
• Telecommunications — Mid‑range line cards and interface bridges leveraging embedded SERDES and configurable I/O for Ethernet, CPRI and other serial protocols.
• Video and Broadcast — Processing and interface functions that benefit from on‑chip memory and DSP slices for timing‑sensitive data paths and high‑speed serial links.
• Industrial Control — Embedded logic, motor control interfaces and sensor aggregation in systems operating across −40 °C to 125 °C.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 tested and qualified for applications requiring automotive reliability and extended temperature range.
• Balanced integration: 17,000 logic elements, substantial embedded RAM and 116 I/Os provide a mid‑range FPGA option that reduces external glue logic and BOM complexity.
• High‑speed serial options (family capability): Embedded SERDES and protocol support enable multi‑Gbps links without separate PHY components.
• Flexible I/O and memory support (family capability): Programmable I/O standards and on‑chip RAM support a wide set of interfaces and buffering requirements.
• Rugged operating range: Surface‑mount 328‑CSBGA package with −40 °C to 125 °C operating range suitable for harsh environments.
• Standards support and configuration flexibility (family capability): Multiple configuration options and compliance with IEEE 1149.1/1532 ease development and in‑field updates.

Why Choose LAE3-17EA-6LMG328E?

The LAE3-17EA-6LMG328E positions mid‑range FPGA capability within an automotive‑qualified LA‑LatticeECP3 offering. With 17,000 logic elements, approximately 0.72 Mbits of embedded memory and 116 I/Os in a compact 328‑CSBGA package, it provides a balanced combination of logic, memory and I/O for designs that require temperature resilience and AEC‑Q100 qualification.

This device is well suited for engineers designing automotive, communications and video systems who need a certified, mid‑density FPGA with family‑level support for high‑speed serial links, DSP acceleration and flexible I/O standards—helping reduce board complexity and accelerate time to production.

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