LAE3-17EA-6FTN256E

The LAE3-17EA-6FTN256E is an LA-ECP3 family field programmable gate array (FPGA) in a 256-BGA (256-FTBGA, 17×17) surface-mount package. It delivers 17,000 logic elements, approximately 0.72 Mbits of embedded memory and 133 user I/Os, with a 1.14 V to 1.26 V core supply and an extended operating range of −40 °C to 125 °C.

Designed for automotive-grade applications, this device is AEC-Q100 tested and qualified and is suitable for high-performance in-vehicle connectivity, signal processing and serial interface functions where robust thermal and environmental performance are required.

Key Features

• Logic Capacity — 17,000 logic elements provide programmable fabric for custom logic, glue logic and mid-density integration.
• Embedded Memory — Approximately 0.72 Mbits of on-chip RAM for buffering, packet storage and small shared memory needs.
• I/O Count & Package — 133 user I/Os in a 256-BGA (256-FTBGA, 17×17) package; surface-mount mounting type for compact board integration.
• Automotive Qualification — AEC-Q100 tested and qualified and listed with an automotive grade and an operating temperature range of −40 °C to 125 °C for automotive system use.
• Core Power — Low-voltage core supply from 1.14 V to 1.26 V to match modern power-rail designs.
• Family-Level High-Speed Serial Options — As a member of the LA-LatticeECP3 automotive family, the device supports embedded SERDES with data rates from 150 Mbps to 3.2 Gbps and family-level protocol support for PCI Express, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO.
• Enhanced DSP and Math Resources — Family sysDSP architecture provides cascadable slices with 18×18 and 36×36 multiplier support and powerful MAC operations for signal processing tasks.
• Clocking and Timing — Family provides up to four PLLs and two DLLs per device for flexible clock management and timing control.
• Configuration & System Support — Family-level features include SPI boot flash interface, dual-boot images, on-chip oscillator and soft error detect embedded macro for system-level configuration and reliability.
• Standards and I/O Flexibility — Family supports a broad range of programmable I/O standards and source-synchronous interfaces, including DDR memory interfaces and high-speed ADC/DAC interface support (as specified for the LA-LatticeECP3 family).
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Automotive Networking & Communications — High-speed serial interfaces and robust temperature qualification make this FPGA suitable for in-vehicle networking, gateway and telematics processing tasks.
• Video Transport and Processing — Family support for SMPTE 3G and high-speed serial links enables video transport, formatting and processing in automotive camera and infotainment subsystems.
• Signal Processing & Sensor Fusion — On-chip DSP resources and embedded multipliers are applicable to sensor data preprocessing, filtering and fusion workloads.
• Memory Interface and Buffering — Embedded RAM and source-synchronous I/O support enable DDR interfacing and buffering for data-intensive automotive functions.

Unique Advantages

• AEC-Q100 Qualified: Explicit automotive qualification provides traceable reliability for vehicle-level deployment and thermal endurance across −40 °C to 125 °C.
• Mid-Density Logic with Embedded Memory: 17,000 logic elements combined with approximately 0.72 Mbits of embedded RAM reduces external component count for many embedded designs.
• Flexible I/O and Package Options: 133 I/Os in a compact 256-BGA (17×17) package simplify board-level routing while supporting diverse interface standards.
• Family-Level High-Speed Serial Capability: Embedded SERDES and protocol support (150 Mbps–3.2 Gbps) enable robust high-speed links for networking and media transport.
• DSP-Ready Architecture: sysDSP slices and dedicated multipliers support efficient implementation of MAC-heavy algorithms and signal processing blocks.
• System Configuration & Reliability: SPI boot, dual-boot capability and soft error detect options support in-field updates and system-level fault mitigation strategies.

Why Choose LAE3-17EA-6FTN256E?

The LAE3-17EA-6FTN256E positions itself as a mid-density, automotive-qualified FPGA that balances programmable logic capacity, embedded memory and robust I/O in a compact 256-BGA package. Its LA-LatticeECP3 family heritage brings DSP slices, high-speed SERDES capability and flexible configuration options suited to in-vehicle communications, signal processing and video transport tasks.

This device is appropriate for engineers and system designers who need a qualified, programmable silicon building block that supports automotive temperature ranges, low-voltage core rails and a wide set of family-level serial and I/O features—helping reduce BOM complexity and accelerate integration into automotive electronic systems.

Request a quote or contact sales to discuss availability, lead times and how the LAE3-17EA-6FTN256E can fit into your next automotive or embedded project.