ICE65L08F-TCB132I

The ICE65L08F-TCB132I is an iCE65 family, low-power Field Programmable Gate Array (FPGA) IC engineered for cost-sensitive, high-volume and battery-conscious applications. It combines a compact 132‑VFBGA package with a programmable logic fabric and on-chip configuration options to support reprogrammable embedded designs.

Built for industrial environments, this device provides 7,680 logic elements, approximately 131,072 bits of on-chip RAM, and 95 programmable I/O pins, delivering a balance of integration, low-voltage operation, and reprogrammability for handheld, portable, and embedded systems.

Key Features

• Core Logic 7,680 logic elements (LUT + flip-flop) providing flexible programmable logic capacity for a range of embedded tasks.
• Embedded Memory Approximately 131,072 bits of on-chip RAM, implemented as multiple 4Kbit RAM blocks for data buffering and small data storage.
• Low-Power Architecture Part of the iCE65 ultra low-power mobileFPGA family; designed for reduced static and dynamic power consumption to support long battery life in portable applications.
• Flexible Configuration Supports reprogrammable operation with nonvolatile configuration memory (NVCM) and external SPI serial Flash configuration options for processor-driven or self-configuration modes.
• I/O and Interfaces 95 programmable I/O pins to connect sensors, peripherals and interfaces; package-level I/O flexibility simplifies system integration.
• Package and Mounting 132‑VFBGA, CSPBGA package (supplier device package: 132‑CSBGA, 8×8), surface-mount for compact board layouts.
• Voltage and Temperature Core supply range 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 85 °C.
• Compliance RoHS compliant for environmental and manufacturing compatibility.
• Development Ecosystem Supported by the iCEcube development tools and design flow for VHDL/Verilog synthesis, place-and-route, and IP integration (iCE65 family tooling).

Typical Applications

• Handheld and Mobile Devices — Low-power architecture and reprogrammability make the device suitable for battery-powered products requiring configurable logic functions and long standby life.
• Portable Instrumentation — Embedded RAM and programmable logic support local data buffering, signal conditioning, and custom processing in compact measurement instruments.
• Industrial Controls and Interfaces — Industrial temperature grading and flexible I/O allow use as protocol bridges, sensor interfaces, and control logic in industrial systems.
• Consumer Electronics Prototyping — Reprogrammable configuration and compact packaging enable rapid iteration for consumer product features and proof-of-concept designs.

Unique Advantages

• Highly integrated programmable logic: 7,680 logic elements with embedded RAM reduce external device count and simplify system architecture.
• Low-voltage, low-power operation: Designed as the iCE65 L (low-power) variant to minimize static and dynamic power for battery-operated designs.
• Flexible configuration modes: On-chip nonvolatile configuration memory plus SPI-based external configuration provide options for in-field updates and secure production programming.
• Compact, board-friendly package: 132‑VFBGA (132‑CSBGA 8×8) surface-mount packaging supports dense PCB layouts and space-constrained designs.
• Industrial temperature support: Rated for −40 °C to 85 °C to meet deployment needs in a wide range of environments.
• Established development toolchain: iCE65 family support for common HDL flows and toolsets reduces development time and eases integration of IP cores.

Why Choose ICE65L08F-TCB132I?

The ICE65L08F-TCB132I positions itself as a compact, low-power FPGA option for engineers who need a balance of programmable logic capacity, embedded memory, and industrial operating capability. Its iCE65 family heritage delivers on low-power design goals alongside flexible configuration and a mature development ecosystem.

This device is well suited to designers building handheld, portable, or industrial embedded systems who require reprogrammability, compact packaging, and consistent operating behavior across the −40 °C to 85 °C industrial range. The combination of logic density, on-chip RAM, and configurable I/O enables integration of custom logic while reducing overall BOM and board area.

If you would like pricing, availability, or technical lead-time information for ICE65L08F-TCB132I, request a quote or submit a product inquiry to receive a formal response and support for your design requirements.