ICE65L08F-TCS110I

IC FPGA 92 I/O 110WLCSP
Part Description

iCE65™ L Field Programmable Gate Array (FPGA) IC 92 131072 7680

Quantity 562 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package110-WLCSPGradeIndustrialOperating Temperature-40°C – 85°C
Package / CaseN/ANumber of I/O92Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs960Number of Logic Elements/Cells7680
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of ICE65L08F-TCS110I – iCE65™ L Field Programmable Gate Array (FPGA) IC 92 131072 7680

The ICE65L08F-TCS110I is a member of the iCE65 ultra low-power mobileFPGA family, delivering reprogrammable programmable logic in a compact 110-WLCSP package for surface-mount assembly. This industrial-grade device provides a balanced mix of logic density, embedded RAM, and I/O for designs requiring low static power, in-system configurability, and production-scale deployment.

Designed for handheld and battery-sensitive applications, the part combines 7,680 logic elements with approximately 131,072 bits of on‑chip RAM and 92 user I/O pins, enabling control, interface, and data buffering functions in space- and power-constrained systems.

Key Features

  • Core Logic  960 programmable logic blocks delivering 7,680 logic elements (LUTs + flip-flops) for implementing control, glue logic, and moderate-density FPGA functions.
  • Embedded Memory  Approximately 128 Kbits of on-chip RAM (131,072 bits) provided by multiple 4Kbit RAM blocks for data buffering and small lookup tables.
  • I/O  92 programmable I/O pins to connect sensors, processors, or peripherals in multi‑domain systems.
  • Low‑power operation  Family-level ultra low-power architecture targeted at handheld applications and long battery life; datasheet highlights microamp-level static current in similar family devices.
  • Configuration Options  Reprogrammable device family features include SPI serial Flash configuration and nonvolatile configuration memory (NVCM) options for in-system and production programming.
  • Supply and Temperature  Supports a core supply range of 1.14 V to 1.26 V and operates across an industrial temperature range of −40 °C to 85 °C.
  • Package & Mounting  110-WLCSP supplier device package, surface-mount compatible for compact PCB layouts and automated assembly.
  • Compliance  RoHS‑compliant materials.

Typical Applications

  • Handheld and Portable Devices  Low static power and on-chip configuration options make the device suitable for battery-powered handheld equipment requiring reconfigurable logic.
  • Battery-Powered Control & Sensing  Embedded RAM and multiple I/O pins enable local buffering and sensor interfacing in power-sensitive sensor hubs and control nodes.
  • High‑volume Consumer Electronics  On-chip nonvolatile configuration memory and support for SPI Flash configuration streamline production programming for volume manufacturing.
  • Industrial Embedded Systems  Industrial operating temperature range and surface-mount, space-efficient packaging suit compact industrial control and interface modules.

Unique Advantages

  • Reprogrammable flexibility:  Supports multiple configuration methods (external SPI Flash or internal NVCM) to fit development and production flows.
  • Compact, production-friendly package:  110-WLCSP and surface-mount design reduce PCB area and support automated assembly for high-volume builds.
  • Balanced logic and memory:  7,680 logic elements with approximately 131 Kbits of embedded RAM provides capacity for control, buffering, and moderate logic functions without external memory.
  • Industrial temperature support:  Rated for −40 °C to 85 °C for reliable operation across common industrial environments.
  • Low-voltage core:  Operates within a core supply range of 1.14 V to 1.26 V, enabling designs optimized for low dynamic power.
  • RoHS compliance:  Meets environmental requirements for lead-free assembly and regulatory frameworks.

Why Choose ICE65L08F-TCS110I?

ICE65L08F-TCS110I positions itself as a compact, industrial-grade FPGA option for designs that require low static power, moderate logic density, and flexible configuration for volume production. The combination of 7,680 logic elements, on-chip RAM, and 92 I/O pins supports a wide range of interface and control tasks while keeping BOM complexity and board area low.

This device is well suited to engineers building battery-conscious handheld products, production-scaled consumer electronics, and industrial embedded modules who need a reprogrammable, space-efficient FPGA with vendor-supplied development tools and proven low-power silicon characteristics.

Request a quote or submit a procurement inquiry to begin evaluation and sourcing for ICE65L08F-TCS110I.

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