ICE65L08F-TCS110I
| Part Description |
iCE65™ L Field Programmable Gate Array (FPGA) IC 92 131072 7680 |
|---|---|
| Quantity | 562 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 110-WLCSP | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | N/A | Number of I/O | 92 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 960 | Number of Logic Elements/Cells | 7680 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of ICE65L08F-TCS110I – iCE65™ L Field Programmable Gate Array (FPGA) IC 92 131072 7680
The ICE65L08F-TCS110I is a member of the iCE65 ultra low-power mobileFPGA family, delivering reprogrammable programmable logic in a compact 110-WLCSP package for surface-mount assembly. This industrial-grade device provides a balanced mix of logic density, embedded RAM, and I/O for designs requiring low static power, in-system configurability, and production-scale deployment.
Designed for handheld and battery-sensitive applications, the part combines 7,680 logic elements with approximately 131,072 bits of on‑chip RAM and 92 user I/O pins, enabling control, interface, and data buffering functions in space- and power-constrained systems.
Key Features
- Core Logic 960 programmable logic blocks delivering 7,680 logic elements (LUTs + flip-flops) for implementing control, glue logic, and moderate-density FPGA functions.
- Embedded Memory Approximately 128 Kbits of on-chip RAM (131,072 bits) provided by multiple 4Kbit RAM blocks for data buffering and small lookup tables.
- I/O 92 programmable I/O pins to connect sensors, processors, or peripherals in multi‑domain systems.
- Low‑power operation Family-level ultra low-power architecture targeted at handheld applications and long battery life; datasheet highlights microamp-level static current in similar family devices.
- Configuration Options Reprogrammable device family features include SPI serial Flash configuration and nonvolatile configuration memory (NVCM) options for in-system and production programming.
- Supply and Temperature Supports a core supply range of 1.14 V to 1.26 V and operates across an industrial temperature range of −40 °C to 85 °C.
- Package & Mounting 110-WLCSP supplier device package, surface-mount compatible for compact PCB layouts and automated assembly.
- Compliance RoHS‑compliant materials.
Typical Applications
- Handheld and Portable Devices Low static power and on-chip configuration options make the device suitable for battery-powered handheld equipment requiring reconfigurable logic.
- Battery-Powered Control & Sensing Embedded RAM and multiple I/O pins enable local buffering and sensor interfacing in power-sensitive sensor hubs and control nodes.
- High‑volume Consumer Electronics On-chip nonvolatile configuration memory and support for SPI Flash configuration streamline production programming for volume manufacturing.
- Industrial Embedded Systems Industrial operating temperature range and surface-mount, space-efficient packaging suit compact industrial control and interface modules.
Unique Advantages
- Reprogrammable flexibility: Supports multiple configuration methods (external SPI Flash or internal NVCM) to fit development and production flows.
- Compact, production-friendly package: 110-WLCSP and surface-mount design reduce PCB area and support automated assembly for high-volume builds.
- Balanced logic and memory: 7,680 logic elements with approximately 131 Kbits of embedded RAM provides capacity for control, buffering, and moderate logic functions without external memory.
- Industrial temperature support: Rated for −40 °C to 85 °C for reliable operation across common industrial environments.
- Low-voltage core: Operates within a core supply range of 1.14 V to 1.26 V, enabling designs optimized for low dynamic power.
- RoHS compliance: Meets environmental requirements for lead-free assembly and regulatory frameworks.
Why Choose ICE65L08F-TCS110I?
ICE65L08F-TCS110I positions itself as a compact, industrial-grade FPGA option for designs that require low static power, moderate logic density, and flexible configuration for volume production. The combination of 7,680 logic elements, on-chip RAM, and 92 I/O pins supports a wide range of interface and control tasks while keeping BOM complexity and board area low.
This device is well suited to engineers building battery-conscious handheld products, production-scaled consumer electronics, and industrial embedded modules who need a reprogrammable, space-efficient FPGA with vendor-supplied development tools and proven low-power silicon characteristics.
Request a quote or submit a procurement inquiry to begin evaluation and sourcing for ICE65L08F-TCS110I.

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