LAE3-17EA-6LFN484E

The LAE3-17EA-6LFN484E is a surface-mount LA-ECP3 family FPGA from Lattice Semiconductor designed for automotive and high-reliability embedded systems. It provides approximately 17,000 logic elements, 222 user I/Os and roughly 0.72 Mbits of on-chip RAM in a 484-BBGA (23×23) package.

With AEC-Q100 qualification, a wide operating range (1.14 V to 1.26 V supply, –40 °C to 125 °C), and family-level features such as embedded SERDES, sysDSP slices, and flexible configuration options, this device targets automotive and other temperature- and reliability-sensitive applications that require moderate logic density and extensive I/O.

Key Features

• Logic Capacity  Approximately 17,000 logic elements suitable for moderate-complexity system integration and control.
• Embedded Memory  Total on-chip RAM of 716,800 bits (approximately 0.72 Mbits) for data buffering, state storage, and local lookup tables.
• I/O Density  222 user I/Os to support a wide mix of peripheral interfaces and board-level connectivity.
• Automotive Qualification & Grade  Grade: Automotive; Qualification: AEC-Q100, enabling deployment in automotive environments requiring that qualification.
• Voltage & Temperature  Core supply range from 1.14 V to 1.26 V and operating temperature from –40 °C to 125 °C for extended-temperature system designs.
• Package & Mounting  484-BBGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for dense PCB integration.
• Family-Level High-Speed Interfaces  LA-LatticeECP3 family features include embedded SERDES with data rates up to 3.2 Gbps, supporting protocols such as PCI Express, Ethernet and CPRI where applicable.
• DSP & Timing Resources  Family architecture includes sysDSP slices and multiple PLL/DLL resources to support multiply-accumulate operations and high-performance clocking (family-level feature).
• Flexible Configuration  Family supports SPI boot flash interface, dual-boot images, slave SPI and other configuration options for in-field update strategies (family-level feature).

Typical Applications

• Automotive Infotainment & Telematics  Use for interface bridging, signal conditioning and protocol handling where AEC-Q100 qualification and extended temperature range are required.
• In-vehicle Networking  Leverage 222 I/Os and family SERDES capability to implement high-density I/O aggregation and high-speed serial links for networking subsystems.
• Sensors & ADAS Subsystems  Applied to sensor interface bridging and local processing tasks that benefit from dedicated DSP slices and embedded memory.
• Industrial Control in Harsh Environments  Suitable for control and interface functions requiring an automotive-grade qualification and wide operating temperature range.

Unique Advantages

• AEC-Q100 Qualified  Provides the qualification pedigree required for automotive deployments and other applications demanding automotive-level reliability.
• Balanced Logic and I/O  Approximately 17,000 logic elements paired with 222 I/Os delivers a balanced platform for designs that need moderate logic density with extensive connectivity.
• Embedded Memory for Local Storage  Approximately 0.72 Mbits of on-chip RAM reduces external memory dependency for many control and buffering tasks.
• High-Temperature Operation  Rated from –40 °C to 125 °C to support systems operating across harsh temperature ranges.
• Compact, Surface-Mount Package  484-BBGA (23×23) provides high pin count in a compact footprint for dense board layouts.
• Family-Level High-Speed and DSP Features  Access to embedded SERDES, sysDSP slices, and multiple PLL/DLL resources (as defined for the LA-LatticeECP3 family) enables implementation of high-speed I/O and signal-processing functions.

Why Choose LAE3-17EA-6LFN484E?

The LAE3-17EA-6LFN484E positions itself as a dependable, automotive-grade FPGA option within the LA-LatticeECP3 family, offering a practical combination of logic resources, on-chip memory and high I/O count in a compact 484-BBGA package. Its AEC-Q100 qualification, wide temperature rating and family-level SERDES and DSP capabilities make it suitable for automotive and other demanding embedded systems where reliability and moderate compute/connectivity are required.

This device is well suited for designers seeking a scalable, qualified FPGA platform with flexible configuration options and the ability to integrate multiple interfaces and signal-processing functions on a single chip.

Request a quote or submit an inquiry to receive pricing, availability and support information for LAE3-17EA-6LFN484E.