LAE3-17EA-6MG328E

The LAE3-17EA-6MG328E is an automotive-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s LA-ECP3 family. It delivers approximately 17,000 logic elements with flexible on-chip memory and a broad set of system-level features tailored for high-speed, in-vehicle and embedded applications.

Designed for surface-mount deployment in a 328-ball CSBGA (10×10) package, this device targets designs that require moderate logic capacity, up to 116 user I/Os, and automotive qualification (AEC-Q100) for operation across -40°C to 125°C.

Key Features

• Core Logic — Approximately 17,000 logic elements organized across 2,125 logic blocks, providing a balanced mix of LUT-based logic for control, glue logic, and mid-density signal processing.
• Embedded Memory — Approximately 0.72 Mbits (716,800 bits) of on-chip RAM for frame buffers, FIFOs, and state storage.
• I/O Capacity & Standards — 116 user I/Os supporting a wide range of interface requirements and flexible I/O standards as provided by the LA-ECP3 family.
• High-speed Serial & DSP Family Features — Family-level features include embedded SERDES and sysDSP slice architecture for high-speed serial connectivity and DSP-style multiply/accumulate operations (family capabilities referenced from LA-ECP3 data sheet).
• Clocking & Timing — Family supports PLLs and DLLs for system clock management and source-synchronous interfaces (features available within the LA-ECP3 family).
• Power & Supply — Core supply range specified at 1.14 V to 1.26 V for stable core operation.
• Package & Mounting — 328-LFBGA (328-CSBGA, 10×10) surface-mount package suitable for compact board designs.
• Automotive Qualification & Temperature Range — AEC-Q100 qualified and graded for automotive use with an operating range of -40°C to 125°C.
• Compliance — RoHS compliant.

Typical Applications

• Automotive In-vehicle Networking — Use as a communications and protocol bridge for in-vehicle networks, leveraging automotive qualification and flexible I/O.
• Sensor Interface and Pre-processing — Mid-density logic plus embedded memory supports interfacing and preliminary processing for sensor data streams in automotive and embedded systems.
• High-speed Serial Bridging — Family SERDES and clocking features enable implementation of high-speed serial links and protocol conversion where moderate logic density is required.

Unique Advantages

• Automotive-ready — AEC-Q100 qualification and a -40°C to 125°C operating range provide the traceable qualification required for in-vehicle deployment.
• Balanced Logic and Memory — ~17k logic elements with ~0.72 Mbits of embedded RAM suits a wide range of mid-density FPGA tasks without over-specifying the bill of materials.
• Compact BGA Footprint — 328-ball CSBGA (10×10) package enables compact board integration for space-constrained automotive and embedded designs.
• Stable Core Supply Window — Narrow core voltage range (1.14 V to 1.26 V) simplifies power delivery planning for consistent device performance.
• Family-level High-speed Capabilities — Access to LA-ECP3 family capabilities such as embedded SERDES, sysDSP slices, and PLL/DLL clocking for designs that require serial links and DSP-style operations.
• Regulatory and Environmental Compliance — RoHS compliance supports contemporary manufacturing and environmental requirements.

Why Choose LAE3-17EA-6MG328E?

The LAE3-17EA-6MG328E positions itself as a practical, automotive-qualified FPGA option when you need moderate logic capacity, a compact BGA package, and family-level high-speed and DSP capabilities. Its combination of ~17,000 logic elements, approximately 0.72 Mbits of embedded memory, and 116 I/Os provides a well-balanced platform for in-vehicle networking, sensor interfacing, and mid-density data path tasks.

For engineering teams targeting scalable, automotive-grade FPGA solutions, this device delivers the traceability, temperature range, and system features drawn from the LA-ECP3 family, helping reduce design iteration and support long-term product lifecycles.

Request a quote or submit an inquiry to receive pricing and availability for LAE3-17EA-6MG328E and to discuss how this automotive FPGA can fit into your next design.