LAE3-35EA-6LFN672E

The LAE3-35EA-6LFN672E is a LA-ECP3 family field programmable gate array (FPGA) optimized for automotive and high-speed embedded applications. It provides a reconfigurable SRAM-based fabric with 33,000 logic elements and extensive I/O, combining DSP slices, high-speed SERDES, and flexible memory to support data-path and interface integration.

Designed and qualified for automotive use (AEC‑Q100), this surface-mount device targets designs that require dense logic, multi-gigabit serial interfaces, and operation across a wide temperature range with controlled supply voltage.

Key Features

• Core Logic  33,000 logic elements for implementing complex control, signal processing, and protocol logic.
• Embedded Memory  Approximately 1.36 Mbits of on-chip RAM (total RAM bits: 1,358,848) plus distributed RAM resources for buffering and packet or sample storage.
• High-speed SERDES  Embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps, with up to four channels per device to support protocols such as PCI Express, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and SerialRapidIO.
• sysDSP™ Slices  Cascadable DSP slice architecture with 12–32 slices per device and advanced multiply/accumulate capabilities, including 18×18 and 36×36 multiplier support for high-performance signal processing.
• Clocking and Timing  Two DLLs and up to four PLLs per device for flexible clock management and high-speed interface timing.
• Flexible sysI/O™ Buffer and Memory Interfaces  Programmable I/O with on-chip termination, DDR/DDR2/DDR3 support with DQS, and a broad set of voltage and differential standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, LVPECL, etc.).
• Automotive Qualification & Reliability  AEC‑Q100 qualification and RoHS compliance for automotive-grade deployment and environmental compliance.
• Package & Mounting  672-ball BBGA package (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor suited for high-density board layouts.
• Power and Temperature  Core supply 1.14 V to 1.26 V and operating temperature range of −40 °C to 125 °C to meet automotive thermal requirements.
• Configuration & System Tools  Supports SPI boot flash interface, dual-boot images, soft error detection macros, and system-level tools such as Reveal Logic Analyzer and ORCAstra configuration utilities.

Typical Applications

• Automotive Networking & Infotainment  Multi‑protocol serial links, packet buffering and protocol bridging for infotainment, telematics and in-vehicle networking subsystems, leveraging AEC‑Q100 qualification.
• High-speed Serial Communications  Implementing SERDES-based links (PCIe, Ethernet variants, CPRI, SMPTE) where multi-gigabit channels and protocol-specific PCS functions are required.
• Signal Processing & Sensor Fusion  DSP slice resources and embedded RAM for real-time multiply-accumulate workloads in sensor interfacing, audio/video processing, or control loops.
• Memory Interface and Data Buffering  Dedicated DDR support with DQS and source-synchronous I/O for systems requiring external memory interfaces and high-throughput buffering.

Unique Advantages

• Automotive-Ready FPGA: AEC‑Q100 qualification and a wide operating temperature range make it suitable for automotive electronic subsystems.
• High I/O Density: Up to 310 I/Os allow for extensive external connectivity and parallel interfaces without additional bridge devices.
• Integrated High-speed SerDes: On-chip SERDES channels (150 Mbps–3.2 Gbps) reduce external PHY requirements for multi-gigabit links.
• Dedicated DSP Fabric: sysDSP slices and a range of multiplier configurations simplify implementation of compute-intensive algorithms on-chip.
• Flexible Configuration: SPI boot, dual-boot support and field update-friendly TransFR I/O options help simplify manufacturing and in-field updates.
• Compact, High-density Package: 672-ball BBGA (27×27) provides a compact footprint for space-constrained automotive and embedded boards.

Why Choose LAE3-35EA-6LFN672E?

The LAE3-35EA-6LFN672E balances substantial logic capacity with embedded memory, DSP resources, and multi-gigabit serial capability in an AEC‑Q100 qualified FPGA. It is positioned for designs that require automotive-grade reliability, rich I/O, and integrated high-speed interfaces without sacrificing board density.

This device is well suited to engineers building automotive communication nodes, high-speed embedded controllers, and systems requiring on-chip signal processing and protocol bridging. The combination of configuration flexibility, system tools, and embedded resources supports scalable designs and streamlined integration into production environments.

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