LAE5U-12F-6BG381E

The LAE5U-12F-6BG381E is an LA‑ECP5 family field programmable gate array supplied in a 381‑FBGA (381‑CABGA, 17×17) package. It integrates approximately 12,000 logic elements and on‑chip memory, with a high I/O count and an automotive qualification targeted at demanding embedded designs.

Designed for automotive and harsh‑environment embedded applications, this device combines mid‑density programmable logic, flexible I/O, and the system features described in the ECP5 Automotive family datasheet to support custom control, interfacing, and signal processing functions.

Key Features

• Logic and Fabric Approximately 12,000 logic elements arranged across 1,500 logic blocks provide the programmable fabric for custom logic, state machines, and control functions.
• Embedded Memory Approximately 0.59 Mbits of on‑chip embedded memory for buffering, FIFOs, and small data structures.
• I/O Density 197 user I/O pins available, enabling broad peripheral connectivity and board‑level integration.
• Automotive Qualification Grade: Automotive with AEC‑Q100 qualification, supporting designs that require automotive component-level qualification.
• Wide Operating Temperature Specified for operation from −40 °C to 125 °C for deployment in temperature‑challenging environments.
• Low‑Voltage Core Core supply range from 1.04 V to 1.155 V to match system power budgets and modern regulator rails.
• Package and Mounting 381‑FBGA (381‑CABGA, 17×17) surface‑mount package that supports compact board designs and high pin density.
• Family Features (per ECP5 Automotive datasheet) Device family features include programmable I/O cells, clocking and PLL resources, DDR memory support, sysDSP slices, SERDES/PCS blocks, boundary‑scan (IEEE 1149.1), and enhanced configuration options for system integration.
• Regulatory and Environmental RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive ECUs — Integration of custom logic, control functions, and I/O aggregation in automotive electronic control units where AEC‑Q100 qualification is required.
• Harsh‑Environment Embedded Systems — Embedded controllers and telematics modules operating across a wide temperature range (−40 °C to 125 °C).
• I/O Bridging and Peripheral Control — High I/O count supports protocol bridging, sensor interfacing, and board‑level peripheral aggregation.
• Memory and Interface Glue Logic — On‑chip RAM and documented DDR memory support in the ECP5 Automotive family enable buffering and interface logic for external memories and peripherals.

Unique Advantages

• Automotive‑Grade Qualification: AEC‑Q100 qualification and automotive grade designation provide component‑level assurance for in‑vehicle applications.
• Balanced Integration: Combination of ~12,000 logic elements, embedded memory, and 197 I/Os reduces the need for multiple discrete controllers and simplifies BOM.
• Wide Temperature Range: −40 °C to 125 °C operating specification supports deployment in temperature‑sensitive environments without additional derating.
• Compact, High‑Density Package: 381‑FBGA (17×17) package enables dense board layouts and high pin count in a compact footprint.
• System Feature Set: ECP5 Automotive family capabilities—programmable I/O, PLL/clocking resources, DDR support, sysDSP slices, SERDES/PCS, and boundary‑scan—provide the building blocks for versatile system designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose LAE5U-12F-6BG381E?

The LAE5U-12F-6BG381E positions itself as an automotive‑qualified mid‑density FPGA that balances programmable logic, embedded memory, and a high I/O count in a compact 381‑FBGA package. Its AEC‑Q100 qualification, wide operating temperature range, and documented ECP5 Automotive family features make it suitable for engineers building reliable, space‑efficient embedded systems that require automotive component qualification.

Choose this device when your design needs a qualified, integrated FPGA platform with ample logic resources (approximately 12,000 logic elements), significant I/O capability (197 pins), and on‑chip memory (approximately 0.59 Mbits) while conforming to automotive and environmental requirements.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability information for the LAE5U-12F-6BG381E.