LAE5UM-45F-6BG381E
| Part Description |
LA-ECP5 Field Programmable Gate Array (FPGA) IC 203 1990656 44000 381-FBGA |
|---|---|
| Quantity | 95 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 203 | Voltage | 1.04 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5500 | Number of Logic Elements/Cells | 44000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1990656 |
Overview of LAE5UM-45F-6BG381E – LA‑ECP5 Automotive FPGA, 44,000 Logic Elements
The LAE5UM-45F-6BG381E is an ECP5™ Automotive family field-programmable gate array (FPGA) from Lattice Semiconductor Corporation. It delivers a balanced mix of programmable logic, on-chip memory, and high-density I/O in a compact 381‑FBGA package targeted at automotive electronic designs.
With 44,000 logic elements, approximately 2.0 Mbits of embedded RAM, and 203 I/O pins, this device is suited for applications that require deterministic logic, flexible interfacing and operation across a wide automotive temperature range.
Key Features
- Logic Capacity 44,000 logic elements provide a substantial fabric for custom logic, protocol bridging, and signal processing implementations.
- Embedded Memory Approximately 2.0 Mbits of on-chip RAM for frame buffering, FIFO storage, and embedded data structures.
- I/O and Interface Support 203 user I/Os support dense external connectivity and flexible I/O mapping for multiple peripheral interfaces.
- Programmable Fabric and DSP ECP5 Automotive family architecture includes programmable slices and DSP-oriented resources as described in the datasheet, enabling arithmetic and signal-processing building blocks.
- High‑speed SerDes and Protocol Support Series datasheet describes SERDES, PCIe, Gigabit Ethernet and serial interface blocks for high-speed link implementations.
- Power and Supply Core voltage supply range: 1.04 V to 1.155 V, enabling targeted power delivery designs.
- Package and Mounting 381‑FBGA supplier package (381‑CABGA, 17 × 17 mm) in a surface-mount form factor for compact board designs.
- Automotive Qualification Grade: Automotive with AEC‑Q100 qualification, and an operating temperature range of −40 °C to 125 °C for automotive environmental requirements.
- Regulatory RoHS compliant.
Typical Applications
- Automotive Gateway & In‑Vehicle Networking Use available I/Os and the family’s high-speed serial blocks to implement protocol bridging, network aggregation, and vehicle gateway functions.
- ADAS and Sensor Fusion Leverage logic capacity, DSP resources, and embedded RAM for consolidating sensor inputs, pre-processing data, and forwarding processed streams to downstream controllers.
- Infotainment and Video Processing On-chip memory and high-speed serial interfaces suit video framing, SD/HD‑SDI bridging and deterministic signal handling in infotainment subsystems.
- Body and Domain Controllers Automotive-grade operation and flexible I/O routing support controller tasks such as lighting, gateway, and comfort-system coordination across temperature extremes.
Unique Advantages
- Automotive-Qualified Platform: AEC‑Q100 qualification and an operating range of −40 °C to 125 °C provide traceable suitability for automotive electronics projects.
- Significant Logic Density: 44,000 logic elements enable integration of multiple functions into a single device, reducing board-level complexity.
- Embedded Memory for Real-Time Tasks: Approximately 2.0 Mbits of RAM support buffering, deterministic data paths, and local storage without external memory in many use cases.
- Rich I/O Count: 203 I/Os allow flexible connectivity options and high pin-availability for sensor, actuator, and network interfaces.
- Compact, Surface‑Mount Packaging: 381‑FBGA (17 × 17 mm) package balances board-area efficiency with high pin density for space-constrained automotive PCBs.
- Standards-Oriented Interface Blocks: Device family datasheet documents SERDES, PCIe and Ethernet-capable blocks to simplify implementation of high-speed links and protocol conversion.
Why Choose LAE5UM-45F-6BG381E?
The LAE5UM-45F-6BG381E places a robust ECP5 Automotive family FPGA into a compact, automotive‑graded package with broad I/O, substantial logic capacity and embedded memory. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it appropriate for designs that must meet automotive environmental requirements while delivering flexible programmable logic and interface integration.
This device is well suited to teams building in-vehicle networking nodes, sensor fusion and ADAS pre-processing blocks, infotainment bridging, or domain controllers that benefit from integrating multiple functions into a single, qualified FPGA platform supported by the ECP5 Automotive family architecture.
Request a quote or submit an inquiry to evaluate pricing and availability for the LAE5UM-45F-6BG381E. Our team can provide ordering information and support for next steps in your design cycle.
