LAMXO3D-4300HC-5BG256E

The LAMXO3D-4300HC-5BG256E is a MachXO3D family field programmable gate array (FPGA) in a 256‑LFBGA package designed for applications requiring non‑volatile, reconfigurable logic with substantial I/O capacity. With 4,300 logic elements, approximately 94,208 bits of embedded RAM, and 206 I/O pins, this device targets system control, interface bridging, and secure configuration tasks where automotive qualification and extended temperature operation are required.

Built on the MachXO3D architecture, the device provides on‑chip features such as embedded security, flexible on‑chip clocking and PLLs, programmable I/O, and hardened peripheral IP blocks to simplify integration and reduce external component count.

Key Features

• Logic Capacity — 4,300 logic elements for glue logic, control state machines, and moderate FPGA fabric tasks.
• Embedded Memory — Approximately 94,208 bits of on‑chip RAM (sysMEM) supporting single/dual/pseudo‑dual port and FIFO modes for buffering and temporary storage.
• High I/O Count — 206 programmable I/O pins with support for pre‑engineered source synchronous I/O and a high‑performance, flexible I/O buffer architecture.
• Non‑volatile, Reconfigurable — MachXO3D family capability for non‑volatile configuration and field reconfiguration, including TransFR reconfiguration support.
• Embedded Security & Hardened IP — Dedicated embedded security block plus hardened I²C and SPI IP cores and timer/counter blocks to accelerate common system functions.
• Clocking & Oscillator — Flexible on‑chip clocking with PLLs and an on‑chip oscillator for reduced external clocking complexity.
• User Flash and Configuration — User Flash Memory (UFM) for storing configuration or system parameters on device.
• Automotive Qualification — AEC‑Q100 qualification and an automotive grade designation; rated for operation from −40 °C to 125 °C.
• Power & Supply — Supports a supply voltage range of 2.375 V to 3.465 V to accommodate a variety of system power rails.
• Package & Mounting — Surface‑mount 256‑LFBGA (256‑CABGA, 14×14) package for high‑density board designs.
• Standards & System Features — Programmable I/O cell architecture, input/output gearbox features, and routing/clock distribution suitable for complex board‑level interfacing.

Typical Applications

• Automotive Control and Domain Interfaces — Suitable for in‑vehicle control, gateway interfacing, and subsystem glue logic where AEC‑Q100 qualification and extended temperature support are required.
• Secure Configuration and Boot — Embedded security block and non‑volatile configuration make the device appropriate for secure system configuration and authentication functions.
• High‑Density I/O Bridging — 206 I/O pins and source‑synchronous I/O capabilities enable use as a protocol bridge, signal aggregator, or interface controller between high‑pin‑count subsystems.
• Embedded System Control — On‑chip timers, hardened interfaces (I²C, SPI), UFM and on‑chip oscillator allow compact system control implementations with reduced external components.

Unique Advantages

• Automotive‑ready Silicon: AEC‑Q100 qualification and a −40 °C to 125 °C operating range support deployment in temperature‑challenging automotive environments.
• Integrated Security and Hardened Peripherals: Built‑in security and common hardened IP cores reduce design risk and speed integration of secure and connected systems.
• Large I/O Surface Area: 206 programmable I/O pins and flexible I/O buffering simplify board routing and reduce the need for external multiplexers or GPIO expanders.
• Non‑volatile Reconfiguration: MachXO3D family non‑volatile configuration and UFM enable reliable field updates and persistent system parameters without external configuration memory.
• Compact, High‑Density Package: 256‑LFBGA (14×14) surface‑mount package balances I/O count and board space for compact system designs.

Why Choose LAMXO3D-4300HC-5BG256E?

The LAMXO3D-4300HC-5BG256E combines a practical logic capacity of 4,300 logic elements with substantial I/O and on‑chip resources to address control, interface, and secure configuration tasks in automotive and embedded systems. Its MachXO3D family features—embedded security, hardened peripheral IP, flexible clocking and PLLs, and non‑volatile reconfiguration—help reduce external components and simplify system-level design.

This part is well suited to engineers specifying solutions that require automotive qualification, extended temperature range, and a balance of logic, memory, and I/O in a compact LFBGA package. The on‑chip resources and hardened IP enable streamlined integration and long‑term robustness in production designs.

If you would like pricing, availability, or to request a formal quote for LAMXO3D-4300HC-5BG256E, please submit a quote request or contact sales through your standard procurement channels.