LAE5UM-45F-7BG381E

The LAE5UM-45F-7BG381E is an automotive‑grade FPGA from Lattice Semiconductor Corporation’s ECP5 Automotive family. It delivers a balance of programmable logic, embedded memory, and I/O density in a 381‑FBGA (381‑CABGA 17×17) surface‑mount package designed for robust embedded and in‑vehicle applications.

Built for applications that require verified automotive qualification, the device combines 44,000 logic elements with approximately 2.0 Mbits of on‑chip RAM and 203 I/O pins while supporting a low core voltage range for compact, power‑efficient system designs.

Key Features

• Logic Capacity  44,000 logic elements for implementing complex programmable logic and control functions.
• Embedded Memory  Approximately 2.0 Mbits of on‑chip RAM for frame buffering, lookup tables, and temporary data storage.
• I/O Density  203 available I/O pins to support extensive peripheral and interface connectivity in a single device.
• Automotive Qualification  Grade: Automotive with AEC‑Q100 qualification, suitable for designs requiring automotive‑level component qualification.
• Power and Supply  Nominal core voltage supply range of 1.04 V to 1.155 V to match low‑voltage system rails and optimize power consumption.
• Package and Mounting  381‑FBGA package (supplier device package: 381‑CABGA 17×17) with surface mount mounting type for compact PCB integration.
• Operating Range  Wide operating temperature range from −40 °C to 125 °C for deployment across demanding thermal environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Automotive Electronic Control  Use as a programmable logic backbone for in‑vehicle controllers and domain gateway functions that require AEC‑Q100 qualified components.
• Sensor Aggregation and Signal Processing  Implement sensor interfacing, data alignment, and preprocessing functions using the device’s logic and embedded RAM resources.
• In‑vehicle Networking and I/O Bridging  High I/O count enables aggregation and protocol bridging between multiple vehicle subsystems and peripheral devices.
• Instrument and Display Control  Drive user interfaces, display pipelines, and custom control logic with compact board area and controlled thermal performance.

Unique Advantages

• Automotive‑qualified platform: AEC‑Q100 qualification provides documented suitability for automotive applications that require component qualification.
• High logic density: 44,000 logic elements enable substantial on‑chip programmable functionality without external glue logic.
• Integrated on‑chip memory: Approximately 2.0 Mbits of embedded RAM reduce dependence on external memory for many buffering and temporary storage tasks.
• Extensive I/O resources: 203 I/O pins simplify board routing and reduce the need for additional I/O expanders.
• Wide temperature and robust packaging: −40 °C to 125 °C operating range and a 381‑FBGA package support deployment in thermally demanding embedded environments.
• Low core supply range: 1.04 V to 1.155 V operation supports low‑voltage system architectures and can help optimize overall power consumption.

Why Choose LAE5UM-45F-7BG381E?

The LAE5UM-45F-7BG381E positions itself as a compact, automotive‑qualified FPGA solution that integrates substantial programmable logic, on‑chip memory, and a high I/O count in a small 381‑FBGA package. It is suited to engineers and procurement teams designing in‑vehicle systems and embedded controllers who require documented AEC‑Q100 qualification, deterministic operating temperature range, and a balance of logic and memory resources.

For designs that demand a combination of integration, predictable thermal performance, and verified automotive qualification, this part offers a scalable platform with the core electrical and mechanical details provided to support robust system design and long‑term deployment.

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