LAE5UM-25F-7BG381E

The LAE5UM-25F-7BG381E is an ECP5 Automotive Family FPGA device from Lattice Semiconductor designed for surface-mount board designs. It integrates 24,000 logic elements, approximately 1.032 Mbits of embedded memory, and 197 I/O pins in a 381‑FBGA package to support embedded and automotive-focused system designs.

With AEC‑Q100 qualification, a broad operating temperature range and on‑chip architectural building blocks described in the ECP5 Automotive datasheet (clocking, programmable I/O, SERDES and memory support), this device targets applications that require robust temperature performance, significant I/O count and flexible programmable logic.

Key Features

• Core Logic 24,000 logic elements provide a mid-range programmable fabric suitable for custom logic, protocol bridging and interface control.
• Embedded Memory Approximately 1.032 Mbits of on‑chip RAM for lookup tables, buffering and local storage.
• I/O Capacity 197 general-purpose I/Os to support wide connectivity and multiple external interfaces.
• Automotive Qualification AEC‑Q100 qualification with an operating temperature range of −40 °C to 125 °C for deployment in temperature-stressed environments.
• Package & Mounting 381‑FBGA supplier device package (381‑CABGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Power Supply Core voltage supply range of 1.04 V to 1.155 V to match targeted power-rail designs.
• Architectural Blocks (per datasheet) On-chip features described in the ECP5 Automotive family datasheet include programmable I/O cells, sysCLOCK PLL, dynamic clock control, SERDES/PCS blocks and DDR memory support for flexible system integration.
• Regulatory & Environmental RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive Systems Use in automotive control and signal processing modules where AEC‑Q100 qualification and extended temperature range are required.
• High‑I/O Embedded Controllers Integration in embedded platforms that need many external interfaces and programmable glue logic leveraging 197 I/Os.
• Protocol Bridging and Interface Conversion Implement protocol adaptation, serialization/deserialization and custom interface logic using the device’s logic fabric and I/O resources.
• Memory‑Assisted Data Handling Local buffering and small‑scale packet storage using approximately 1.032 Mbits of embedded RAM for timing-critical tasks.

Unique Advantages

• AEC‑Q100 Qualified Device: Provides explicit automotive-grade qualification for designs that require certified component reliability across temperature extremes.
• Substantial I/O Count: 197 I/Os reduce external multiplexing and simplify board-level routing for multi-interface systems.
• Balanced Logic and Memory: 24,000 logic elements paired with approximately 1.032 Mbits of embedded memory enable mid-density custom logic and buffering without external SRAM for many designs.
• Compact FBGA Package: 381‑FBGA (381‑CABGA, 17×17) surface‑mount package helps conserve PCB area while delivering high pin count.
• Defined Core Supply Range: Core voltage support from 1.04 V to 1.155 V helps align with targeted power-rail architectures.
• Documented On‑Chip Resources: The ECP5 Automotive family datasheet documents clocking, SERDES, DDR support and programmable I/O features that enable system-level integration choices.

Why Choose LAE5UM-25F-7BG381E?

The LAE5UM-25F-7BG381E positions itself as a mid-density, automotive-qualified FPGA option that balances logic capacity, embedded memory and a high I/O count in a compact FBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it suitable for temperature-challenged environments where documented architectural features such as programmable I/O, clocking primitives and SERDES/DDR support (detailed in the ECP5 Automotive datasheet) are relevant.

This device is well suited to engineers and teams implementing embedded controllers, interface converters, and in-vehicle or other temperature-demanding systems that require a reliable, programmable silicon building block with clear, verifiable specifications.

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