LAE3-35EA-6LFTN256E
| Part Description |
LA-ECP3 Field Programmable Gate Array (FPGA) IC 133 1358848 33000 256-BGA |
|---|---|
| Quantity | 41 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 133 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1358848 |
Overview of LAE3-35EA-6LFTN256E – LA-ECP3 Automotive FPGA, 33,000 logic elements, 133 I/Os, 256-FTBGA
The LAE3-35EA-6LFTN256E is a LA-ECP3 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for automotive-grade embedded systems. It pairs a mid-density FPGA fabric with high-speed SERDES, dedicated DSP resources, and flexible I/O to address high-integration signal processing and protocol bridging tasks.
With 33,000 logic elements, approximately 1.36 Mbits of embedded memory, and up to 133 user I/Os in a 256-FTBGA (17×17) package, this device targets applications that require performance, on-chip memory, and robust operation across a wide automotive temperature range.
Key Features
- Core Logic 33,000 logic elements provide substantial LUT capacity for mid-density FPGA designs.
- Embedded Memory Approximately 1.36 Mbits of on-chip RAM (1,358,848 total RAM bits) plus distributed RAM for buffering and data staging.
- High-Speed SERDES & Protocol Support Embedded SERDES support data rates from 230 Mbps to 3.2 Gbps and up to four channels per device for protocols such as PCI Express, Ethernet (1GbE/SGMII/XAUI), CPRI, SMPTE 3G, and Serial RapidIO.
- sysDSP Slices Dedicated DSP slice architecture supports high-performance multiply-accumulate operations for signal and data processing tasks.
- Flexible I/O 133 user I/Os with programmable I/O buffer options and source-synchronous support for DDR and high-speed parallel interfaces.
- Power and Configuration Core supply voltage range of 1.14 V to 1.26 V with flexible configuration options including SPI boot flash interface and dual-boot image support.
- Automotive Qualification & Reliability AEC-Q100 tested and qualified, rated for operation from −40 °C to 125 °C, and RoHS compliant.
- Package & Mounting 256-ball FTBGA (17×17) surface-mount package for space-constrained automotive PCB designs.
- System-Level Support Supports IEEE 1149.1 and IEEE 1532, with configuration and debug utilities referenced for device configuration and analysis.
Typical Applications
- Automotive networking and infotainment High-speed in-vehicle interfaces using Ethernet/SGMII/XAUI and other serial protocols for data aggregation and gateway functions.
- High-speed protocol bridging Protocol conversion and bridging tasks leveraging embedded SERDES for PCIe, Serial RapidIO, and similar links.
- Video and broadcast interfaces SMPTE 3G and related video transport support for in-vehicle video processing and camera interfaces.
- Signal processing and acceleration DSP-intensive tasks using sysDSP slices for multiply-accumulate operations in real-time signal paths.
Unique Advantages
- AEC-Q100 automotive qualification: Ensures the device meets automotive-grade reliability and temperature stress requirements.
- Balanced logic and memory density: 33,000 logic elements paired with approximately 1.36 Mbits of embedded RAM supports complex control and buffering on-chip, reducing external memory needs.
- High-speed serial capability: Embedded SERDES with multi-gigabit data-rate support enables direct interfacing to modern serial protocols without extensive external PHYs.
- Wide operating temperature range: −40 °C to 125 °C rating supports deployment in demanding environments.
- Compact, manufacturable package: 256-FTBGA (17×17) surface-mount package simplifies PCB layout for space-constrained automotive designs.
- Flexible configuration and system support: SPI boot, dual-boot capability, and standard compliance (IEEE 1149.1/1532) ease development and field updates.
Why Choose LAE3-35EA-6LFTN256E?
The LAE3-35EA-6LFTN256E delivers a convergence of mid-range logic capacity, focused DSP capabilities, and robust high-speed serial interfaces in an AEC-Q100-qualified FPGA. It is positioned for designers who need reliable, automotive-capable programmability with on-chip memory and SERDES bandwidth to handle protocol bridging, signal processing, and networked subsystems.
This device is suitable for teams building production automotive electronics and other high-reliability embedded systems that require scalable FPGA resources, flexible configuration options, and long-term operational stability across automotive temperature extremes.
Request a quote or submit an inquiry to get pricing, availability, and additional technical support for the LAE3-35EA-6LFTN256E.
